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Ventec's Thomas Michels Elected to EIPC Board of DirectorsJanuary 11, 2018 | Ventec International Group
Estimated reading time: 1 minute
Ventec International Group has announced that Thomas Michels, Managing Director, Ventec Europe, has been elected to the Board of Directors of the EIPC, effective immediately. Michel's appointment expands the Board to 15 members from around Europe who, as a group, continue to accurately reflect the role of the institute throughout the value chain of Europe's electronic packaging and interconnection industry.
"Thomas's extensive experience in the electronics manufacturing industry will add a valuable perspective to our Board of Directors," said Alun Morgan, Chairman of the EIPC. "We appreciate his willingness to serve as a director and look forward to benefitting from his contribution towards the future growth and direction of the EIPC."
"Over the past 10 years, Ventec has built a strong foothold in Europe with fully equipped service centers and almost 50 employees. It is a great honor to be elected to the Board of Directors of the EIPC and a reflection of our continued commitment to the European market," said Thomas Michels.
Michels is managing director at Ventec Europe and a shareholder of Ventec International Group. In his role as managing director, he has overall responsibility for all European operations, supply chain and sales & marketing activities as well as leading the company's global non-CCL/consumables business. His operational responsibilities also extend into India. In 2003, Michels founded TMT Trading GmbH, a leading global distributor of flexible laminates (ThinFlex/Arisawa) and drill materials, which merged with Ventec International Group in 2016 to offer a one-stop-shopping solution for Ventec’s European and American customers. Prior to these roles, Michels worked for Cimatec and Du Pont. He is an active member of the steering committee/board of ZVEI's PCB und Electronic Systems division (German association for manufacturers, which represents the interests of the high-tech industry) and a regular presenter and keynote speaker at important European industry events.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
The "Global Copper Clad Laminates Market (by Type, Application, Reinforcement Material, & Region): Insights and Forecast with Potential Impact of COVID-19 (2023-2028)" report has been added to ResearchAndMarkets.com's offering.
The SCHMID Group, a global solution provider for the high-tech electronics, photovoltaics, glass and energy systems industries, will be exhibiting at productronica in Munich from November 14 – 17, 2023.
The topic of intrinsic copper structure has been largely neglected in discussions regarding the PCB fabrication quality control process. At face value, this seems especially strange considering that copper has been the primary conductor in all wiring boards and substrates since they were first invented. IPC and other standards almost exclusively address copper thickness with some mild attention being paid to surface structure for signal loss-mitigation/coarse properties.
At PCB West, I sat down for an interview with John Andresakis, the director of business development for Quantic Ohmega. I asked John to update us on the company’s newest materials, trends in advanced materials, and the integration of Ticer Technologies, which Quantic acquired in 2021. As John explains, much of the excitement in materials focuses on laminates with lower and lower dielectric constants.
Printed circuit board (PCB) reliability testing is generally performed by exposing the board to various mechanical, electrical, and/or thermal stimuli delineated by IPC standards, and then evaluating any resulting failure modes. Thermal shock testing is one type of reliability test that involves repeatedly exposing the PCB test board to a 288°C pot of molten solder for a specific time (typically 10 seconds) and measuring the number of cycles it takes for a board’s copper layer to separate from the organic dielectric layer. If there is no delamination, fabricators can rest assured that the board will perform within expected temperature tolerances in the real world.