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DuPont Announces Board of Directors for the Planned Independent Electronics Company

03/27/2025 | PRNewswire
DuPont announced the members of the future board of directors for the independent Electronics public company that will be created following its intended spin-off from DuPont.

HARTING 3D-Circuits Leads 3D-MID Innovation: Transforming Consumer Electronics with Advanced Technology

03/27/2025 | PRNewswire
The consumer electronics industry is experiencing a remarkable transformation, propelled by rapid technological advancements and an increasing demand for compact, efficient, and multifunctional devices. Central to this evolution is 3D-MID (Three-Dimensional Mechatronic Integrated Devices) technology, which redefines design standards and drives innovation.

Point2 Technology, Sumitomo Electric Industries New Partnership

03/26/2025 | Point2 Technology
Point2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Sumitomo Electric Industries, Ltd. (SEI), a global leader in high-speed communication systems, announced the signing of a Memorandum of Understanding (MOU) to collaborate on the development of SEI’s next-generation 25G optical transceiver modules.

Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch

03/27/2025 | Jerome Larez -- Column: Global PCB Connections
As a field application engineer for a major Chinese PCB company, I see firsthand the challenges and, more excitingly, the trends shaping our industry. Talking to engineers, designers, and procurement teams worldwide, one thing is clear: PCBs have come a long way, but we’re barely scratching the surface of what’s possible. Here are 10 trends I believe will define our industry over the next decade.

Electroninks' MOD and iSAP Game Changers

03/25/2025 | Marcy LaRont, PCB007 Magazine
Electroninks, a prominent player in particle-free conductive inks, recently announced an exciting new range of metal-complex inks for ultra high density interconnect (UHDI) technology. At the SMTA UHDI Symposium in January, Mike Vinson, COO of Electroninks, gave a presentation on this line of MOD inks, which are versatile and suitable for a range of applications that require ultra-dense, miniaturized, and high-frequency technology. Mike says his technology is a game changer and will revolutionize UHDI circuit fabrication. 
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