IPC Honors Rockwell Collins and Northrop Grumman with Corporate Recognition Awards
March 2, 2018 | IPCEstimated reading time: 2 minutes
IPC bestowed its highest corporate honors on two member companies, Rockwell Collins and Northrop Grumman Corporation. During a luncheon at IPC APEX EXPO 2018, the Peter Sarmanian Corporate Recognition Award was presented to Northrop Grumman and the Stan Plzak Corporate Recognition Award was presented to Rockwell Collins.
The Peter Samarian Corporate Recognition award, named for a former IPC Board Chairman, recognizes an IPC-member company in the printed board industry that has supported IPC through participation in technical and management programs while providing leadership for the industry.
Northrop Grumman, an IPC member since 1962, has long held a leadership role in IPC, participating in meetings for decades, making a significant impact on both IPC and the industry. More than 50 of its staff members are active on approximately 120 technical committees ranging from flexible circuits and fabrication processes to conflict minerals and intellectual property standards. Almost 1,000 Northrop Grumman employees have earned CIT, CIS, CID, CID+ and EMS certifications across all Northrop Grumman locations.
Named for former IPC Board Chairman and founding member of the IPC Electronics Manufacturing Services Industry Management Council, the IPC Stan Plzak Corporate Recognition Award honors an IPC-member company in the electronics assembly industry that actively contributes to the industry while supporting IPC technical and/or management programs.
Rockwell Collins has been a member of IPC since 1965, and has devoted many staff members to IPC standards development. Nearly 40 Rockwell Collins employees provide leadership and technical expertise on more than 100 standards development committees dedicated to topics such as assembly and joining, electronic documentation and e-textiles. More than 250 staff members have earned CIT, CIS, CID, CID+, and EMS certification across all Rockwell locations.
“We are privileged to have Northrop Grumman and Rockwell Collins as members of IPC,” said John Mitchell, IPC president and CEO. “Their decades of leadership, commitment to providing staff resources to standards development, and engagement in IPC education and event activities, have contributed to IPC’s global growth in the electronics industry.”
About IPC
IPC s a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,300-member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China. For more information, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Foxconn's Rotating CEO, Yang Qiujin, Named One of Asia's Most Influential Women
10/15/2025 | Foxconn ElectronicsHon Hai Precision Industry Co., Ltd.'s management team has once again received recognition! Rotating CEO Kathy Yang has been named to Fortune magazine's " Most Powerful Women Asia 2025 " list of the 100 most influential women in Asia , achieving a remarkable fifth place in her debut.
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.