Sypris Lands Additional Contracts with Harris
March 13, 2018 | Sypris Electronics LLCEstimated reading time: 1 minute
Sypris Electronics LLC, a subsidiary of Sypris Solutions Inc., has recently received multiple contract awards from Harris Corp. to manufacture a variety of mission-critical electronic assemblies for a number of government programs. Terms of the agreements were not disclosed.
The awards from Harris include the production of a variety of electronic assemblies for multiple munition dispensing systems. Awards included systems for the US Navy as well as multiple foreign military programs. Production will begin in 2018.
"This was another important win for Sypris in the DoD sector of our business," said Jim Long, vice president and general manager of Sypris Electronics. "Harris is a leader in this military application and our technical and operational strengths were key to this win. We are honored to have this opportunity to expand our relationship with Harris."
About Sypris Electronics
Sypris Electronics is a trusted provider of electronic solutions, addressing customers’ needs for building complex, mission-critical electronic and electro-mechanical devices and integrated systems. Backed by 50 years of experience, Sypris’ engineering and manufacturing services span our customers’ product life cycle all within a culture of continuous improvement and Six Sigma/Lean thinking. Partners from multiple agencies and tier one companies in Military (DoD), Space, Medical, Civil Avionics, Telecom, and Industrial markets team with Sypris to deliver high-reliability electronics built with strict adherence to regulated requirements. For more information, please visit www.sypriselectronics.com.
Suggested Items
Airbus to Lead NATO Next Generation Rotorcraft Capability Concept Study
07/26/2024 | AirbusThe NATO Support and Procurement Agency (NSPA) has awarded a contract to Airbus Helicopters to lead a concept study in the frame of the Next Generation Rotorcraft Capability (NGRC) project under which the participants combine efforts to work on design, development and delivery of a medium multi-role helicopter.
Innovative and Cost-effective BGA Re-balling
07/23/2024 | Shavi Spinzi, Nano Dimension/EssemtecA new, high-quality BGA re-balling process, which is integrated into an all-in-one solution of dispensing and placement equipment developed by Essemtec, brings new opportunities for the reapplication of expensive BGA components. This new method seamlessly integrates the sequence of flux deposition and ball (sphere) placement with the subsequent soldering process.
SEMI Applauds U.S. Chips Act Award For Entegris Semiconductor Materials Facility in Colorado
07/01/2024 | SEMISEMI, applauded the United States Department of Commerce's announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support Entegris construction of a state-of-the-art manufacturing center for advanced materials and process solutions for leading-edge semiconductors in Colorado Springs, Colorado.
Lockheed Martin Celebrates Opening Of 122,000-Square Foot, $18M Engineering Facility In North Alabama
05/31/2024 | Lockheed MartinLockheed Martin, U.S. Department of Defense, state and local officials celebrated the opening of the company’s new $18 million engineering facility, labs and demonstration center in Huntsville. The 122,000-square foot facility has space for 500 employees who will advance national security capabilities and drive innovation in North Alabama.
RTX's Collins Aerospace Awarded Survivable Airborne Operations Center Subcontract
05/27/2024 | RTXCollins Aerospace, an RTX business was awarded a multi-billion-dollar subcontract as part of a team led by SNC to design, develop and deliver systems and products for a new aircraft under the U.S. Air Force's Survivable Airborne Operations Center (SAOC) program.