Tom Leone, president, and Zach Dismukes, sales and support engineer from Bowman, discuss their XRF equipment, the new IPC 4552A spec, and how they go to market.
To watch the interview, click here.
The rules are changing. Explore the technologies, design strategies, and manufacturing innovations challenging conventional wisdom while revealing which fundamentals remain critical to success.
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
Estimated reading time: 1 minute
Tom Leone, president, and Zach Dismukes, sales and support engineer from Bowman, discuss their XRF equipment, the new IPC 4552A spec, and how they go to market.
To watch the interview, click here.
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