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Advanced Copper Foil Announces New Arsenic-Free Copper FoilsMay 11, 2018 | Advanced Copper Foil
Estimated reading time: Less than a minute
Advanced Copper Foil and its supply partner, Circuit Foil Luxemburg, are pleased to introduce its new arsenic-free copper foils. Effective immediately, the ED copper foils TWLS and TZA will be manufactured as 100% arsenic-free. All traces of arsenic have been removed from the treatment process of these two copper foil types. There is no change in the base copper foil or its properties. As mandated by REACH and European Union Regulation, toxic substances such as arsenic, will be phased out. Arsenic is identified as a poisonous substance that can have severe adverse effects on humans and the environment.
“The printed circuit board industry is constantly changing, and we are pleased to announce this significant development to our copper foil supply chain. The elimination of arsenic from the electronics industry is an important step towards environmental and social responsibility”, says Kieran Healy, managing director of Advanced Copper Foil.
About Advanced Copper Foil
Advanced Copper Foil is the exclusive distributor of circuit foil Luxemburg and specializes in the tooling of copper foils and the manufacturing of aluminum supported copper foils for the North American printed circuit board industry. For more information, click here.
The "Global Copper Clad Laminates Market (by Type, Application, Reinforcement Material, & Region): Insights and Forecast with Potential Impact of COVID-19 (2023-2028)" report has been added to ResearchAndMarkets.com's offering.
The SCHMID Group, a global solution provider for the high-tech electronics, photovoltaics, glass and energy systems industries, will be exhibiting at productronica in Munich from November 14 – 17, 2023.
The topic of intrinsic copper structure has been largely neglected in discussions regarding the PCB fabrication quality control process. At face value, this seems especially strange considering that copper has been the primary conductor in all wiring boards and substrates since they were first invented. IPC and other standards almost exclusively address copper thickness with some mild attention being paid to surface structure for signal loss-mitigation/coarse properties.
At PCB West, I sat down for an interview with John Andresakis, the director of business development for Quantic Ohmega. I asked John to update us on the company’s newest materials, trends in advanced materials, and the integration of Ticer Technologies, which Quantic acquired in 2021. As John explains, much of the excitement in materials focuses on laminates with lower and lower dielectric constants.
Printed circuit board (PCB) reliability testing is generally performed by exposing the board to various mechanical, electrical, and/or thermal stimuli delineated by IPC standards, and then evaluating any resulting failure modes. Thermal shock testing is one type of reliability test that involves repeatedly exposing the PCB test board to a 288°C pot of molten solder for a specific time (typically 10 seconds) and measuring the number of cycles it takes for a board’s copper layer to separate from the organic dielectric layer. If there is no delamination, fabricators can rest assured that the board will perform within expected temperature tolerances in the real world.