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Advanced Copper Foil Announces New Arsenic-Free Copper Foils
May 11, 2018 | Advanced Copper FoilEstimated reading time: Less than a minute
Advanced Copper Foil and its supply partner, Circuit Foil Luxemburg, are pleased to introduce its new arsenic-free copper foils. Effective immediately, the ED copper foils TWLS and TZA will be manufactured as 100% arsenic-free. All traces of arsenic have been removed from the treatment process of these two copper foil types. There is no change in the base copper foil or its properties. As mandated by REACH and European Union Regulation, toxic substances such as arsenic, will be phased out. Arsenic is identified as a poisonous substance that can have severe adverse effects on humans and the environment.
“The printed circuit board industry is constantly changing, and we are pleased to announce this significant development to our copper foil supply chain. The elimination of arsenic from the electronics industry is an important step towards environmental and social responsibility”, says Kieran Healy, managing director of Advanced Copper Foil.
About Advanced Copper Foil
Advanced Copper Foil is the exclusive distributor of circuit foil Luxemburg and specializes in the tooling of copper foils and the manufacturing of aluminum supported copper foils for the North American printed circuit board industry. For more information, click here.
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Material Insight: The Material Science of PCB Thermal Reliability
10/25/2023 | Preeya Kuray -- Column: Material InsightPrinted circuit board (PCB) reliability testing is generally performed by exposing the board to various mechanical, electrical, and/or thermal stimuli delineated by IPC standards, and then evaluating any resulting failure modes. Thermal shock testing is one type of reliability test that involves repeatedly exposing the PCB test board to a 288°C pot of molten solder for a specific time (typically 10 seconds) and measuring the number of cycles it takes for a board’s copper layer to separate from the organic dielectric layer. If there is no delamination, fabricators can rest assured that the board will perform within expected temperature tolerances in the real world.