-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueWet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Printed Circuits Upgrades Photo Department
May 22, 2018 | Printed CircuitsEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/4416/3125/6277/Orbotech_Paragon.jpg)
Flex and rigid flex circuit board manufacturer Printed Circuits has added two new pieces of equipment to their photo department including a new Orbotech Paragon 8-watt laser direct imager and a Fusion 22 automatic optical inspection machine with laser via inspection capabilities.
"We purchased a 16-watt laser direct imager a few years back and needed to add capacity, particularly for inner and outer layer photoimaging," said Matt Tannehill, executive vice president. "The new LDI uses LSO, or large scan optics, for very high throughput with excellent quality at the same time, which is critical for our customers' success. The new machine also has a very wide depth of field, which is ideal for manufacturing flex and rigid flex circuits as they can often have a great deal of topography on the outer layer surfaces. We are extremely pleased to have this new capability."
"The Fusion 22 AOI machine is a natural complement to the laser direct imager. It is designed for laser via inspection and HDI applications that have become increasingly popular. With a very high throughput and low false defect rate, the Fusion greatly enhances our productivity in that department," Matt continued. "We are pleased to continue to augment our capabilities to meet our customers' expectations today and in the future."
About Printed Circuits
Printed Circuits is a US manufacturer of multilayer flex and rigid flex printed circuit boards with over 40 years of experience building circuits typically used in high reliability applications such as medical, military and commercial electronics where customers place a premium on reliability, package density, and weight. For more information, click here.
Suggested Items
Archer Delivers First Midnight Aircraft to The United States Air Force
08/16/2024 | BUSINESS WIREArcher Aviation Inc. announced it has delivered its first Midnight aircraft to the USAF to evaluate as part of its AFWERX Agility Prime contract valued at up to $142M..
MilDef to Deliver Rugged Displays to European Military Vehicle Manufacturer
08/14/2024 | CisionVia the acquisition of certain assets of Advanced Vision Technologies Ltd (AVT), MilDef has now been entrusted to deliver intelligent and rugged displays to key European land vehicle programmes.
CACI Awarded $319 Million Task Order to Provide Intelligence Systems Expertise to the U.S. Army
08/05/2024 | CAC, Inc.CACI International Inc announced that it has been awarded a five-year task order valued at up to $319 million to provide intelligence systems expertise to the U.S. Army, Communications-Electronics Command (CECOM), Software Engineering Center (SEC), Electronic Warfare and Sensors Directorate (IEWSD), Army Reprogramming Analysis Team-Program Office (ARAT-PO).
Airbus to Lead NATO Next Generation Rotorcraft Capability Concept Study
07/26/2024 | AirbusThe NATO Support and Procurement Agency (NSPA) has awarded a contract to Airbus Helicopters to lead a concept study in the frame of the Next Generation Rotorcraft Capability (NGRC) project under which the participants combine efforts to work on design, development and delivery of a medium multi-role helicopter.
Innovative and Cost-effective BGA Re-balling
07/23/2024 | Shavi Spinzi, Nano Dimension/EssemtecA new, high-quality BGA re-balling process, which is integrated into an all-in-one solution of dispensing and placement equipment developed by Essemtec, brings new opportunities for the reapplication of expensive BGA components. This new method seamlessly integrates the sequence of flux deposition and ball (sphere) placement with the subsequent soldering process.