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Printed Circuits Upgrades Photo DepartmentMay 22, 2018 | Printed Circuits
Estimated reading time: 1 minute
Flex and rigid flex circuit board manufacturer Printed Circuits has added two new pieces of equipment to their photo department including a new Orbotech Paragon 8-watt laser direct imager and a Fusion 22 automatic optical inspection machine with laser via inspection capabilities.
"We purchased a 16-watt laser direct imager a few years back and needed to add capacity, particularly for inner and outer layer photoimaging," said Matt Tannehill, executive vice president. "The new LDI uses LSO, or large scan optics, for very high throughput with excellent quality at the same time, which is critical for our customers' success. The new machine also has a very wide depth of field, which is ideal for manufacturing flex and rigid flex circuits as they can often have a great deal of topography on the outer layer surfaces. We are extremely pleased to have this new capability."
"The Fusion 22 AOI machine is a natural complement to the laser direct imager. It is designed for laser via inspection and HDI applications that have become increasingly popular. With a very high throughput and low false defect rate, the Fusion greatly enhances our productivity in that department," Matt continued. "We are pleased to continue to augment our capabilities to meet our customers' expectations today and in the future."
About Printed Circuits
Printed Circuits is a US manufacturer of multilayer flex and rigid flex printed circuit boards with over 40 years of experience building circuits typically used in high reliability applications such as medical, military and commercial electronics where customers place a premium on reliability, package density, and weight. For more information, click here.
Seven microelectronics firms received nearly $10 million in combined funding to commercialize technologies of interest to the U.S. military services as winners of the Defense Business Accelerator (DBX) Microelectronics Challenge. This groundbreaking initiative is funded by the Department of Defense (DoD) and led by the U.S. Partnership for Assured Electronics (USPAE).
Raytheon, an RTX business, has been awarded a four-year, $15 million contract from DARPA to increase the electronic capability of radio frequency sensors with high-power-density Gallium Nitride transistors. Raytheon is the world's leading manufacturer of military-grade Gallium Nitride, a cutting-edge semiconductor technology that, when used in radar systems, improves range and radar resource management handling. This new prototyping work is being performed under DARPA's Technologies for Heat Removal in Electronics at the Device Scale program, known as THREADS.
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