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MacDermid Enthone Releases New Immersion Tin for QFNs
August 27, 2018 | MacDermid Enthone Electronics SolutionsEstimated reading time: 1 minute
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, announces the release of the PackagePrep CE Tin S process. This simplified tin plating process for singulated QFN package side walls provides consistent solder flank fillet formation for a more reliable solder joint under the increasingly demanding requirements of the automotive electronics industry. The superior fillet formation allowed by this new immersion tin process also improves the ease of assembly for “lead-less” chip packages, such as QFNs for a more reliable inspection of the assembled surface mount packaging, eliminating the need for X-Ray inspection of the solder joint. The process provides solderability that meets JEDEC Standard J-STD-002D.
Rich Retallick, director of Electronics Materials, MacDermid Enthone, noted, “Given the rapid growth in automotive electronics where QFNs are widely utilized, reliability is a key priority. We’re excited to provide our customers with the enhanced solderability and the option for automated optical inspection (AOI) provided by the PackagePrep CE Tin S process.”
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics—in everything you see, and in many things you don’t—MacDermid Enthone is there. For more information, click here.
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