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American Standard Circuits Launches Fusion Bonding for RF Boards
September 17, 2018 | American Standard CircuitsEstimated reading time: 2 minutes
American Standard Circuits is now offering fusion bonding of PTFE-based materials. PTFE material fusion bonding uses high temperature (≥700°F/371°C) to bond PTFE directly to the copper circuitry and surrounding PTFE. This achieves bonding of the core materials without the use of a separate bonding agent acting as a bond ply or pre-preg.
With fusion bonding, you achieve an entirely isotropic package for stripline circuitry. This may be done utilizing either a PTFE core with copper removed or with a special uncompressed PTFE ply which acts as a filler/bond ply but consists of the same base material as the rest of the PTFE cores within the package. It is this uniformity and the reduction or elimination of DK variation within the package that allows the unparalleled performance and design accuracy.
When discussing the introduction of fusion bonding, President and CEO Anaya Vardya said, “Over the past several years we have expended a great deal of time, money and man power to assume a leadership role in the RF microwave market. The development of fusion bonding technology represents another step towards providing our customers with a complete RF microwave solution. Our team here at American Standard Circuits has done a great job in helping us to gain the technological capability to attain our market leadership position.”
As a leader in RF technology, American Standard Circuits has authored the micro eBook “The Printed Circuit Board Designer’s Guide to….Fundamentals of RF/Microwave PCBs". Download it here.
About American Standard Circuits
American Standard Circuits (ASC) prides itself on being a total solutions provider, manufacturing quality rigid, metal-backed, RF/microwave, flex, and rigid-flex PCBs for the medical, automotive, industrial, defense, and aerospace markets in volumes from test and prototypes to large production orders. ASC has the expertise to provide a wide variety of technologies in a time-critical environment. Their qualifications include AS9100 Rev D, ISO 9001:2015, MIL-PRF 31032, MIL-PRF-55110, MIL-PRF-50884 certification and ITAR registration. In addition to manufacturing in the USA, ASC can transition and manage your PCB requirements to lower cost regions via its qualified supply chain of offshore partners. ASC also holds many key patents for metal bonding processes. For more information about American Standard Circuits' services or to ask one of their technology experts a question click here.
Visit I-007eBooks to download your copies of American Standard Circuits’ micro eBooks today:
The Printed Circuit Board Designer’s Guide… to Fundamentals of RF/ Microwave PCBs
The Printed Circuit Designer's Guide to... Flex and Rigid-Flex Fundamentals
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Maximizing ROI Through Better Wet Process Control
08/20/2024 | I-Connect007 Editorial Team“When things get out of control, the variation in your wet process begins,” says Mike Carano,. “Just because they look like good boards and may even pass electrical test, it does not necessarily mean you have good boards. Once the chemistry is headed toward the right or left side of the process control parameter cliff, the plating is compromised. If the copper is thinner than it should be, when the customer puts it into service, the board may fail after 500 cycles vs. the requisite 1,000 or 2,000 cycles. The root cause issue is that you plated 7/10ths of a mil of copper instead of one-mil of copper because you were not controlling your process. The fact that you passed your own electric test becomes inconsequential.”
The Chemical Connection: Controlling an Alkaline Etch Bath With Low Copper Loading
08/07/2024 | Don Ball -- Column: The Chemical ConnectionThis month, I wanted to continue my discussion on how much process control is actually needed for high-density circuit production. However, in the last month, I have been called on to help with a specific process control problem: how to control an alkaline etch bath when you’re not etching much copper. This problem has been cropping up more frequently as smaller shops (and a few larger ones) concentrate on low-volume, high-value plated through-hole panels such as prototypes, resistor cores, etc.