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EIPC Seeks Technical Papers for 2019 Winter Conference
September 24, 2018 | EIPCEstimated reading time: Less than a minute
The European Institute for the PCB Community (EIPC) is seeking technical papers for presentation at the upcoming EIPC Winter Conference to be held from February 14–15, 2019, in Milan, Italy.
Abstracts should be in not later than October 8, 2018.
For the detailed Call for Papers, click here. Click here for the abstract submission form, and click here for the conference registration form.
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