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Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids

07/09/2025 | Happy Holden -- Column: Happy’s Tech Talk
When we consider via reliability, the major contributing factors are typically processing deviations. These can be subtle and not always visible. One particularly insightful column was by Mike Carano, “Causes of Plating Voids, Pre-electroless Copper,” where he outlined some of the possible causes of hole defects for both plated through-hole (PTH) and blind vias.

Study on Resonance Mitigation in Metallic Shielding for Integrated Circuits

07/08/2025 | Maria Cuesta-Martin, Victor Martinez, Vidal Gonzalez Aguado, Würth Elektronik
Inherent cavity resonant modes often lead to significant degradation of shielding effectiveness, responsible for unwanted electromagnetic coupling. Cavity resonant modes of the metal shielding enclosure can produce two adverse problems: the mutual coupling among different RF modules and shielding effectiveness reduction of the metal enclosure. The cabinets serve to shield certain components from electromagnetic interference (EMI). However, these cavities present some resonance peaks at 5 GHz, making it impossible to use them at higher frequencies.

MKS Opens New State-of-the-Art Facility in Derio, Spain to Strengthen Iberian and Southern European Presence

05/28/2025 | MKS’ Atotech
MKS’ Atotech, a leading surface finishing brand of MKS Instruments, proudly announces the official opening of its new facility in Derio, Bizkaia, Spain, a strategic investment designed to support the company’s General Metal Finishing business across the Iberia Region, including Spain and Portugal.

Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC

05/22/2025 | Indium Corporation
Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.

Rheinmetall, ICEYE Sign MoU to Establish Joint Venture

05/14/2025 | Rheinmetall
Rheinmetall and globally leading SAR satellite manufacturer ICEYE are further intensifying their cooperation. The two companies intend to establish a joint venture for satellite production. A memorandum of understanding to this effect was signed on 8 May 2025.
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