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Rheinmetall, Hologate Sign Strategic Cooperation

12/03/2024 | Rheinmetall
Düsseldorf-based Rheinmetall AG, a leading company in the field of defense and security technologies, and Hologate, the world's leading provider of sophisticated Extended Reality (XR) solutions in the field of simulation and entertainment, intend to work closely together in the future to develop innovative simulation solutions.

Exploring Innovation Through Alternate Metals and Sputtering

11/11/2024 | Marcy LaRont, I-Connect007
Dr. Evelyne Parmentier has a PhD in physical chemistry from ETH Zurich. She was born in Luxembourg and is now a proud resident of Switzerland, where she has been part of Dyconex’s R&D engineering team for the past two years. Evelyne gave a presentation at the EIPC Summer Conference titled “Functionalization of Printed Circuit Boards Through Introducing Alternate Metals Through Sputtered Layers,” where she asked her audience, “If there are 93 metals in the periodic table, why are we not using more of them?”

BWXT to Acquire L3Harris’ A.O.T. Business to Expand Special Materials Portfolio

11/05/2024 | L3Harris Technologies
BWX Technologies, Inc. and L3Harris Technologies, Inc. announced the signing of a purchase agreement for BWXT to acquire L3Harris’ Aerojet Ordnance Tennessee, Inc. (A.O.T.) business for approximately $100 million.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

11/01/2024 | Andy Shaughnessy, Design007 Magazine
It’s been a busy week in PCB design, fabrication, and assembly. We published some mixed news about the EMS segment, and an article about the supply chain. Are companies holding onto too much inventory? After the recent supply chain snafus, I can certainly understand why they might. We have an article about liquid metal ink, a cool new technology developed by LDQX, formerly known as Averatek. We also have an article about fighting advanced counterfeiting methods, and news about an acquisition by Siemens.

Unlocking Advanced Circuitry Through Liquid Metal Ink

10/31/2024 | I-Connect007 Editorial Team
PCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
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