NASA Looks to the Future, Seeks Next Level Visionary Aerospace ConceptsDecember 11, 2018 | NASA
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NASA is looking for trailblazing ideas that could one day change what’s possible in space. The NASA Innovative Advanced Concepts (NIAC) program is seeking Phase II proposals for the continuation of Phase I research studies.
NIAC helps NASA look to the future by funding far reaching, early stage space technology concepts with the potential of transforming exploration and science missions. This research may one day enable new capabilities or significantly alter approaches for operating, building and landing structures in space.
"NIAC studies are exciting, and in the initial phase we see a lot of brand-new ideas,” said NIAC Program Executive Jason Derleth. “Phase II is where our fellows can dig into the engineering details of their creative ideas, utilizing more time and resources. We can’t wait to see how the next round of selected proposals progress.”
NIAC Phase II awards can be up to $500,000 for two years, allowing researchers to further develop Phase I concepts. NASA will accept NIAC Phase II proposals of no more than 15 pages in length through Feb. 14, 2019 (a notice of interest is due by Dec. 17, 2018). The solicitation is only open to current or previously awarded NIAC Phase I fellows who have successfully completed a Phase I study but have not yet been awarded a Phase II study. NIAC Phase I final reports must be received before submitting to Phase II.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.
I have been in and around circuit boards most of my life. I started 20 years ago in my family’s PCB shop, leaving after a couple of years to start my own software company. About a year ago, I returned to the family business, and the first thing I noticed was that nothing had really changed. We were doing the same things in the same way as the day I left. After talking to several experts in the industry, I realized it was worse than that: The manufacturing of PCBs had not changed in 70 years.