-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Gen3 Introduces AutoSIR2 + and AutoCAF2+
December 13, 2018 | Gen3 SystemsEstimated reading time: 1 minute
SIR and CAF testing have become significant demands by the industry in the drive to improve and enhance electronic circuit reliability.
As an example, the evolution of electric vehicles and driverless technology AKA EV’s, show that the three phase developments will be 470V; 850V and 1,250V continuous operation. Testing under these conditions requires extreme health and safety precautions, especially as the tests are performed in damp / heat chambers at typically 850C / 85% RH for up to and beyond 2,500 hours.
Other applications however, show demand for ultra-low voltage testing at
Gen3 has a continuous product development program to meet the ever-changing demands of both our existing and new customers. We are proud to introduce the new AutoSIR2+ and the AutoCAF2+ instruments.
These incorporate new and greatly improved software that provides superior flexibility and which also permit simultaneous tests at up to 4 different voltages. The user can select 3 voltages from the choice of 0V; 3.3V; 5V; 10V; 12.5V; 15V; 50V and 100V. In addition, by using an external power supply, an additional test may, simultaneously, be run at up to 1,250V.
The Gen3 Systems AutoSIR2+ system represents a dramatic improvement over existing SIR test alternatives, and its shielded precision electronics allows for state-of-the-art accuracy resistance measurements to be made up to 1014 Ω.
About Gen3 Systems
Gen3 Systems is a specialist manufacturer of test and measurement equipment used to help predict reliability of electronic circuits and systems in the field. In addition, the company designs and manufactures dip and spray coating process equipment in both in-line and bench-top formats. Gen3 is a specialist distributor for several leading equipment manufacturers including, Nordson SELECT, FineTech, MBTech, MEK, Hirox, and, Aprotec Instrumentation, solder paste inspection (SPI) systems.
Gen3 Systems also provides training, equipment and expertise for manufacturers requiring assessment of their electronic products’ reliability. The company also operates a test service and assists with standards development via both the IPC, IEC, and UL. Gen3 Systems operates from premises near Farnborough Business Park, on the M3 corridor and just 30 minutes from London’s Heathrow Airport.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.