Dan’s Biz Bookshelf: ‘The Next RenAIssance: AI and the Expansion of Human Potential’
The Chemical Connection: When the Industry Moves Faster Than the Standards
Driving Innovation: Selecting the Right Laser Source
GreenSource Fabrication Announces Acquisition of AWP Group
December 17, 2018 | GreenSourceEstimated reading time: 1 minute
GreenSource Fabrication LLC, has announced the acquisition of majority ownership in AWP Group GmbH with immediate effect. Terms of the agreement were not disclosed.
According to GreenSource VP, Alex Stepinski, “AWP was the #1 supplier by both order value and sheer number of machines (over 100) in our next generation PCB FAB/IC Substrate smart factory which we built in 2017-2019. Together with AWP, we developed the process integration network of both hardware and software required to achieve for the first time a world-wide, a fully automated and green advanced HDI/FPC/IC Substrate facility with true single piece flow. GreenSource Fabrication’s North American facility strongly competes with the Asia-Pacific market leaders on cycle time, operating cost, and capability, and is the world leader in sustainable green & lean operations. Due to these innovations, and the overwhelming demand for such next generation solutions worldwide, it became apparent that both GreenSource and AWP could mutually benefit from the closer collaboration which could only be made possible by a unified ownership.”
AWP Group GmbH will continue to operate with its current management team consisting of minority owners Henk van der Meij and Jochen Zeller, but will collaborate with GreenSource in market areas where there are strong scaled economies. For instance, GreenSource will act as an applications tech center for the continuing development of AWP equipment technology and software solutions, and AWP will now have full access to the unique intellectual property associated with GreenSource’s fully-green operations for integration into their current and future product offerings. The acquisition also provides AWP with a US base at the GreenSource site from which to facilitate expansion into the North American equipment market.”
Both companies will be exhibiting jointly for the first time at the IPC/APEX Show in San Diego in January, 2019.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.
Building Industry-ready Talent Through Standards-based Education
04/27/2026 | Global Electronics AssociationRecently, Sichuan Modern Vocational College organized 132 students to complete IPC-A-610 Acceptability of Electronic Assemblies Certified IPC Specialist (CIS) training and certification.
Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies
04/27/2026 | Nolan Johnson, I-Connect007This multi-expert roundtable explores cybersecurity measures specific to electronics manufacturing. NEC’s Watanabe Hiroyaki, Divyash Patel, CEO of MX2 Technologies, and Ali Pabrai, CEO at EC First, join moderator Nolan Johnson for a deeper discussion on cybersecurity certifications.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
04/21/2026 | Steve Williams -- Column: The Right ApproachThe Defense Logistics Agency has initiated formal proceedings to cancel the military's primary performance specification for printed circuit boards, a move that could reshape how the U.S. defense industrial base qualifies and sources one of its most critical electronic components. On March 4, 2026, DLA Weapons Support issued a memorandum to military and industry coordination activities announcing that MIL-PRF-31032, along with its six associated specification sheets, has been proposed for cancellation. A 30-day comment period was allotted, with concurrence or comments due by April 3, 2026.