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Electronics Industry Praises U.S. Government Notice of Funding Opportunity for 'Advanced Packaging' Technologies

02/29/2024 | IPC
IPC praised today’s issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.

Flexible Thinking: Embedded Design—A Term With Multiple Meanings

02/28/2024 | Joe Fjelstad -- Column: Flexible Thinking
With the seemingly endless ways that electronic products are worming their way into our lives, what was once “nice to own” is increasingly considered indispensable. The capabilities of these products have been driven by relentless improvements at every level of the manufacturing chain, from individual transistors (which are approaching Angstrom levels) to systems the size of buildings supporting Bitcoin mining and increasingly distributed AI products.

Nano Dimension Announces Important Business Updates

02/28/2024 | Nano Dimension Ltd.
Nano Dimension Ltd., a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printing solutions, today announced a series of updates covering its repurchase plan, repeat customer success, and an R&D milestone.

X-BATT Unveils Groundbreaking Bio-Derived Composite Anode Materials for Lithium-Ion Batteries

02/27/2024 | BUSINESS WIRE
Coffee has helped power people for years. Now, coffee and other bio-based resources may help power lithium-ion batteries, thanks to breakthrough technology from X-BATT®.

UL-Authorization Received for Ventec High-CTI, Halogen Free FR15.1 Substrates VT-447C and VT-441C

02/27/2024 | Ventec
Ventec International Group Co., Ltd. , is pleased to announce that UL’s evaluation of two of Ventec’s halogen-free, phenolic cured high-CTI substrates have received authorization to apply the UL mark.
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