Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand
It’s Only Common Sense: Stop Pitching, Start Listening
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
RTW IPC APEX EXPO 2019: Ventec's Goodwin on Global Technology Directions
February 5, 2019 | Real Time with...IPCEstimated reading time: Less than a minute
Mark Goodwin, Ventec International Group CEO EMEA and USA, speaks with I-Connect007 Technical Editor Pete Starkey on technology directions globally and in the North American market. He also explains how Ventec's quality accreditations, technical expertise, and flexible manufacturing capacity continue to strengthen their leading position.
To watch the interview, click here.
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
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