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Siemens, TSMC Extend Collaboration to Drive Semiconductor Design Innovation

04/25/2025 | Siemens
Siemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.

HEITEC Expands Deployment of Aegis Software’s FactoryLogix MES to Boost Sustainable Manufacturing

04/23/2025 | Aegis Software
Aegis Software, a global provider of Manufacturing Execution System (MES) software, announces that HEITEC’s business unit Elektronik, a leading manufacturer of complex electronic solutions based in Eckental, Germany, is expanding its use of the FactoryLogix® MES platform to additional products.

IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data

04/23/2025 | IPC
IPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing.

Yamaha Boosts YRi-V AOI Productivity with 3D Component Update

04/22/2025 | Yamaha Robotics
Yamaha Robotics Europe SMT Section has introduced instantaneous 3D component update, included with the latest software release for YRi-V automatic optical inspection (AOI) systems, letting users optimise inspection programs without stopping production. 

STMicroelectronics Future-proofs the Development of Next-gen Cars with Innovative Memory Solution for Automotive Microcontrollers

04/22/2025 | STMicroelectronics
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has announced Stellar with xMemory, a new generation of extensible memory embedded into its Stellar series of automotive microcontrollers, that transforms the challenging process of developing software-defined vehicles (SDV) and evolving platforms for electrification.
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