-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Nano Dimension and Harris Receive Grant for ISS Project
May 31, 2019 | Nano DimensionEstimated reading time: 2 minutes

Nano Dimension Ltd. has received a grant approval from the Israel Innovation Authority, for developing hardware, in cooperation with Harris Corporation, that will fly on the International Space Station (ISS) and communicate with Harris’ ground based satellite tracking station in Florida. This project will provide a systematic analysis of 3D printed materials for radio frequency (RF) space systems, especially for Nano-satellites.
The total approved budget for the Israeli portion of this project is approximately $416,000 (NIS 1,500,000), of which the Israel Innovation Authority will finance 40%. According to the terms of the grant, Nano Dimension will pay royalties on future sales up to the full grant amount.
This unique project is being conducted in collaboration with Harris Corporation, a leading technology innovator that provides solutions that connect, inform and protect its clients. The Harris portion of the project is sponsored by a grant from Space Florida. During this one-year project, both companies will optimize the designs of the 3D printing process and RF components and prepare a system for the flight studies at the ISS.
Nano Dimension awarded Space Florida Grant by Governor of Florida Ron DeSantis, and the Israel Innovation Authority
This project has been selected by the Center for the Advancement of Science in Space, the manager of the ISS U.S. National Laboratory, to fly the space flight experiment on the ISS, using the team’s 3D printed materials and circuits. In this project, the companies will pioneer the first of a kind space flight experiment, that will fly in space at low earth orbit for one year on the ISS, helping to understanding how 3D printed circuits, systems, and materials will endure in various space environments.
This project will demonstrate innovative methods for manufacturing new RF systems. Until now, manufacturing of RF systems has remained static for the last 30 years with each circuit in its own “gold box/boxes” interconnected with cables and connectors. With 3D printing, the industry can explore a new manufacturing paradigm, that eliminates manual labor and streamlines production. Another benefit to this technology is a reduction/elimination of wasted material, making it a “green” process.
About Harris Corporation
Harris Corporation is a leading technology innovator, solving customers’ toughest mission-critical challenges by providing solutions that connect, inform and protect. Harris supports government and commercial customers in more than 100 countries and has approximately $6 billion in annual revenue. The company is organized into three business segments: Communication Systems, Space and Intelligence Systems and Electronic Systems.
About Nano Dimension Ltd
Nano Dimension is a leading electronics provider that is disrupting, reshaping, and defining the future of how cognitive connected products are made. With its unique 3D printing technologies, Nano Dimension is targeting the growing demand for electronic devices that require increasingly sophisticated features. Demand for circuitry, including PCBs - which are the heart of every electronic device - covers a diverse range of industries, including consumer electronics, medical devices, defense, aerospace, automotive, IoT and telecom. These sectors can all benefit greatly from Nano Dimension’s products and services for rapid prototyping and short-run manufacturing.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
U.S. Manufacturing Jobs Decline Amid Tariffs and Immigration Crackdown
09/17/2025 | I-Connect007 Editorial TeamManufacturers in the U.S. are cutting jobs even as President Donald Trump pushes policies he says will revitalize the industry. Employers shed 12,000 manufacturing jobs in August, while payrolls in the sector have fallen by 42,000 since April, according to a new analysis from the Center for American Progress (CAP) based on government labor data.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
GlobalFoundries Joins World Economic Forum’s Global Lighthouse Network for Manufacturing Excellence
09/17/2025 | GlobalFoundriesGlobalFoundries announced that the World Economic Forum (WEF) has designated its 300mm fab in Singapore as part of the Global Lighthouse Network (GLN) of advanced manufacturers.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
Indium President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India
09/17/2025 | Indium CorporationIndium Corporation President and CEO Ross Berntson will deliver the Electronic Industries Association of India (ELCINA) CEO Forum keynote at Productronica India, to be held September 17-19 in Bengaluru, India.