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11/10/2025 | Real Time with...SMTAI
Established in Italy in 1976, SPEA designs and manufactures automatic test equipment for various industries, including automotive, aerospace and defense, medical, consumer electronics, and energy. Recognized as one of Italy’s top-performing companies, SPEA continues to innovate in test automation technology. At SMTAI 2025, Dustin Warren, vice president of sales for SPEA America, discussed how the company is bridging the gap between older in-circuit test (ICT) systems and newer, more advanced testing solutions.

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Learning With Leo: UHDI—The Next Leap in PCB Manufacturing

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High density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.

UHDI Fundamentals: UHDI Technology and Automated Inspection

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Following up on the last article on integrating ultra high density interconnect (UHDI) PCB technologies and Quality 5.0, here we will do a deeper dive into the automated inspection component. UHDI applications demand extreme precision, with line/space dimensions below 25 µm and microvias below 30 µm. Automated inspection systems are essential to achieving the defect-free fabrication required at these scales, and legacy automated inspection systems are becoming obsolete and ineffective.

OSI Systems Reports Fiscal Q1 2026 Financial Results

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OSI Systems, Inc. announced its financial results for the first quarter of fiscal 2026.
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