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First EIE Direct Imager at Electronic Interconnect: One Year Production Update
August 16, 2019 | First EIE SAEstimated reading time: 1 minute
For more than a year, Electronic Interconnect Ltd. has been using the First EIE Direct Imager—EDI500 HV—in production at its Elk Grove Village, Illinois, location. The First EIE Direct Imager is fully manufactured in Switzerland, including the broad wavelength optical engine, which provides an operator-friendly user interface on a highly reliable platform while addressing advanced production needs.
Based on DMD technology, First EIE’s Direct Imager features a high-powered ultraviolet light source, which provides a full spectral range from 365 nm to 450 nm, allowing full compatibility with most resists and solder masks. The feature-rich software includes advanced local scaling or simple panel scaling; a high-resolution, fully automated target finder; exposable features down to 1-mil L/S; and real-time Z-axis auto-focus. The EDI500 addresses panel sizes up to 24″ x 27″ with a compact footprint, standard utility connections, and maintenance-friendly design.
Sanjay Shah, Electronic Interconnect COO, said, “I am very happy with this equipment. Now, I am sure that the light engine with the broad wavelength spectrum has many benefits for my exposure process with dry films, in particular with solder mask. I have seen a significant difference in the quality and finish of direct imaging as well as conventional mask exposed with the First EIE Direct Imager due to the broad UV spectrum. The exposing time with the direct imaging mask is quite impressive.”
About Electronic Interconnect
U.S. printed circuit board manufacturer Electronic Interconnect serves design engineers, OEMs, and contract manufacturers throughout the country. With over 30 years of experience, their customers have benefitted from unique technical advancements in areas such as thermal management, metal cladding, heavy copper, and solderability.
About First EIE
First EIE SA, Switzerland, provides outstanding equipment for leading markets seeking high-end imaging technologies. With its 512-beam optical engine, the latest generation of RP photoplotters achieves features down to 5 microns at 50000 dpi. The EDI Series for Direct Imaging enables the possibility to expose the all UV Photo sensitive substrates from Dry Film to Solder Mask including Legend.
Headquartered in southern California, all4-PCB is First EIE’s representative in North America.
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Sweeney Ng - CEE PCBSuggested Items
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10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.