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Ventec Expands Thermal Interface Materials RangeAugust 29, 2019 | Ventec
Estimated reading time: 2 minutes
Ventec International Group Co., Ltd., a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions, is pleased to announce the addition of two new thermally conductive thin isolation foil materials to its range of Thermal Interface Materials (TIM) under its distribution agreement with EMI Thermal.
Initially for the European market, Ventec teamed up with EMI Thermal to provide a range of Thermal Interface Materials (TIM) that are a perfect complement to Ventec’s IMS material families, thermally conductive and standard laminates and prepregs for multilayer PCB’s. The range of materials distributed through Ventec, which includes double sided thermal tape, electrical insulators, natural graphite and void fillers, has now been expanded with the addition of two new UL94 V-0-recognized thin isolation/thermal conductive foil materials.
T-P INS 2 and T-P INS 3 A0/A1 are high-performance electrically insulating, thermally conductive interface materials that offer thermal conductivity of 1.8-3W/mK. Further features include high tensile strength (≥0.8-1.0) designed to prevent cut through and electrical shorts, low thermal impedance (0.16˚C in2/W), no viscosity and a thickness of 0.18-0.30mm, making them the ideal material choice for access control, computer and network & communications applications including SMPS, telecom devices, visual devices, networking products, LCD-TV, notebook PC’s, PC’s, etc. Full material specifications can be found at http://www.ventec-group.com/products/thermal-interface-material/.
To offer even greater value to customers, Ventec continues to maintain and build upon its one-stop-service solution for PCB materials to the European PCB and electronics industry, by offering a range of third party products that complement its own extensive product range, including flexible laminates (ThinFlex/Arisawa) and a full range of PCB production consumable products covering standard and specialty (Centrum & Glossback) drill materials, copper foils including ACF.
About Ventec International Group
Ventec International is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR4, high-speed/low-loss- & high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network. For more information, visit www.venteclaminates.com.
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
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The topic of intrinsic copper structure has been largely neglected in discussions regarding the PCB fabrication quality control process. At face value, this seems especially strange considering that copper has been the primary conductor in all wiring boards and substrates since they were first invented. IPC and other standards almost exclusively address copper thickness with some mild attention being paid to surface structure for signal loss-mitigation/coarse properties.
At PCB West, I sat down for an interview with John Andresakis, the director of business development for Quantic Ohmega. I asked John to update us on the company’s newest materials, trends in advanced materials, and the integration of Ticer Technologies, which Quantic acquired in 2021. As John explains, much of the excitement in materials focuses on laminates with lower and lower dielectric constants.
Printed circuit board (PCB) reliability testing is generally performed by exposing the board to various mechanical, electrical, and/or thermal stimuli delineated by IPC standards, and then evaluating any resulting failure modes. Thermal shock testing is one type of reliability test that involves repeatedly exposing the PCB test board to a 288°C pot of molten solder for a specific time (typically 10 seconds) and measuring the number of cycles it takes for a board’s copper layer to separate from the organic dielectric layer. If there is no delamination, fabricators can rest assured that the board will perform within expected temperature tolerances in the real world.