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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

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Nordson Electronics Solutions to Demonstrate Automated Fluid Dispensing and Selective Soldering Systems at productronica 2025

11/06/2025 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for printed circuit board assembly and advanced packaging at Productronica 2025, joining their longstanding distribution partners Amtest Group, stand A2.532, and smartTec Gmbh, stand A2.527, as well as in the Future Packaging Hybrid Live Lab, stand B2.261.

GlobalFoundries, Silicon Labs Expand Partnership to Accelerate Wireless Connectivity Solutions and Strengthen U.S. Chip Manufacturing

11/05/2025 | GlobalFoundries
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Learning With Leo: UHDI—The Next Leap in PCB Manufacturing

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High density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.

On the Line With… Ultra HDI, Episode 8: “Materials, Up and Coming Capabilities,” Now Available

11/05/2025 | I-Connect007
I-Connect007 is excited to announce the release of the eighth episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Materials, Up and Coming Capabilities,” host Nolan Johnson sits down with resident expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to discuss how material selection influences the Ultra HDI (UHDI) manufacturing process.

High Density Packaging User Group Announces ASKPCB Membership

11/03/2025 | HDP User Group
High Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
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