-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
AT&S and Chongqing University Collaborate on Research and Education
October 7, 2019 | AT&SEstimated reading time: 2 minutes
AT&S (Chongqing) Co., Ltd and the Chongqing University have signed a framework agreement of strategic cooperation on September 26. According to the agreement, both parties will collaborate on a range of academic and educational programs including internship programs targeting different majors, designed curriculums for the IC substrates industry, talents recruitment, joint R&D projects, continuing education cooperations and joint student exchange programs between Universities in Chongqing and in Austria. It represents a milestone for AT&S as a first high-end IC substrates manufacturer in China partnering with one of the universities affiliated to the Ministry of Education of China in research and education excellence.
Chen-Jiang Phua, CEO of AT&S Business Unit Mobile Devices and Substrates, commented: “The agreement represents a win-win partnership. AT&S will be able to leverage Chongqing University’s talented students and outstanding faculty for expertise in cutting-edge technologies. Chongqing University will benefit from AT&S’s long-standing R&D capabilities and its market and commercialization expertise as of one of the world’s leading HDI PCBs and IC substrates manufactures.”
According to Phua, AT&S (Chongqing) offers training ground on site for students from Chongqing University. In September, around 80 undergraduates with the major in Engineering & Applied Chemistry spent one week with AT&S and got practical exposure from experts of the company whom enriched their knowledge in the semiconductors related manufacturing industry. It is one of the ways for AT&S to help students to begin their careers as a professional and solve the talent shortage for this fast growing key industry.
“Chongqing University combines socio-economic vision, technological capabilities, and commitment to talent development in a very creative and rather unique way, and the cooperation is a reflection of our commitment to the intellectual and human potential of this distinguished institution. We are proud to be partnering with Chongqing University to pursue scientific leadership and research excellence. Our collaboration agreement lends strong support to the notion that Chongqing will become an international logistics hub and an engine of modern industrialization”, commented Andreas Gerstenmayer, CEO of AT&S.
Chongqing is an important production bases for AT&S worldwide. In this city, AT&S has established two state-of-the-art plants for fast growing semiconductor industry and advanced HDI since 2011. In July 2019, AT&S annouced to invest a further €1 billion Euros in Chongqing over the next five years on a new manufacturing facility for high-end IC substrates.
Chongqing University was founded in 1929. It is a key national university located in Chongqing. Among its various departments, Chongqing University is especially highly ranked in the Built Environment, Engineering, Technology and Business disciplines.
Suggested Items
Altium to Unveil Groundbreaking Industry Solution at Electronica 2024
10/25/2024 | AltiumAltium, a global leader in electronics design and lifecycle management, is set to introduce three transformative product offerings at the upcoming Electronica 2024 conference in Munich, Germany.
2024 IPC CEMAC China Electronics Manufacturing Annual Conference Focuses on the Electronics Industry’s Future
10/24/2024 | IPCThe 2024 IPC CEMAC China Electronics Manufacturing Annual Conference, co-organized by IPC and the Shanghai Pudong New Area Quality Technology Association, kicked off with a grand opening ceremony in Shanghai. Themed "Making Your Imagination Reality," the event has brought together leaders, technical experts, and corporate representatives from the global electronics manufacturing industry to explore future trends and opportunities.
iNEMI Connector Footprint Tolerance End-of-Project Webinar
10/24/2024 | iNEMIiNEMI’s PCB Connector Footprint Tolerance Project investigated industry capability, risks and mitigation strategies associated with high-bandwidth I/O connector footprints.
Test Research, Inc. (TRI) to Exhibit at SMTA Space Coast Expo & Tech Forum 2024
10/24/2024 | Test Research Inc.Test Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, will participate in the SMTA Space Coast Expo & Tech Forum 2024.
Highlights of the ICT 50th Anniversary Symposium
10/24/2024 | Pete Starkey, I-Connect007Why does it always rain when I attend these events? Temperatures were dropping, daylight was shrinking, and there were seasonal colour changes in wet hedgerows as I travelled to Gloucestershire for the 50th Anniversary Symposium of the Institute of Circuit Technology at Puckrup Hall near Tewkesbury in mid-October. It was a memorable occasion: Nostalgic for my contemporaries who remembered our industry at its most prosperous, technically outstanding in the quality and significance of presentations to an attentive audience of printed circuit professionals, and complemented by the sharing of ideas, information, and trade gossip within a friendly community at the evening gathering.