-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Emerging Themes: Day 2 Coverage of productronica 2019
November 14, 2019 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

Day two at productronica, and the themes emerge: 5G, high-speed, low-loss, and new formulations. These were the catchphrases of the materials suppliers. It is clear from all the conversations that designers and board specifiers need to learn all they can about the new materials emerging on the market.
The equipment makers are engaging in that same conversation with new capital equipment that either provides additional capabilities to support these new materials, or data collection and reporting via the Industry 4.0 protocols, or both. Wet process equipment continues to move toward the realization of the digital factory and the “lot size of one," with systems that adjust the parameters as needed, automatically.
CAM providers are chipping away at the work process walls that have traditionally existed between design and CAM, as well as knocking holes in the hand-off to fabrication to assembly. New software features and applications are aimed squarely at taking the drudgery out of the operation, finally letting the computers do what they do well.
Chemistry providers had news to share, as well. Atotech announced the addition-through-acquisition of the Via King graphite-based product to the portfolio. And not to be left out at all, solder mask and conformal coatings suppliers talked about environmental extreme protection, application accuracy, and efficiency.
It becomes very clear, after day two that the digitalization of the electronics manufacturing factory is the most effective path to increased profitability.
Enjoy the photos from Wednesday’s productronica show floor. We’ll continue to bring you quick coverage throughout the rest of the week from Messe München and the productronica exposition.
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.