Meet Industry Experts at the 2019 International Electronics Circuit Exhibition (Shenzhen)!

Reading time ( words)

The International Technical Conference, to be held concurrently with the 2019 International Electronics Circuit Exhibition (Shenzhen) (formerly International Printed Circuit & APEX South China Fair), gives you valuable insights on the latest market trends to prepare you to face challenges and transform your business to a new level. Join us for the Conference at the Shenzhen Convention & Exhibition Center, China, 4-6 December 2019.

Stay on top with the industry leaders and experts

The 2019 Conference will feature international specialists and industry experts to address the hottest topics covering both market trend and technical updates of the industry. Here are some hot sessions that you can't miss!

  • Keynote Speeches from Mr Canice Chung and Mr. You Lei, Chairmen HKPCA
  • The Challenge and Opportunity of 5G High Frequency to PCB and PCBA, Mr. Liu Zhe Chief Engineer, ZTE Corporation
  • Which Way is the PCB Industry Heading? Dr. Hayao Nakahara, President, N.T. Information Ltd.
  • PCB Market Update, Dr. Shiuh-Kao Chiang, Managing Partner, Prismark
  • IC Substrate Technology Characteristics Study, Mr. Lin Ting Hao, Sr. Project Director, Kinsus Interconnect Technology Corp.
  • Challenges and Opportunity to PCB Material and Processing Technology from Automotive Electronics, Mr. James Tam, Project Manager, Robert Bosch Co., Ltd.

Get the latest show news at



Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

04/23/2021 | Andy Shaughnessy, I-Connect007
This week, we bring you a wide swath of news, columns, and articles from the past week. Altium announced a new cloud platform that connects design stakeholders with users of its Altium 365 environment. Cadence Design Systems has acquired a company that develops computational fluid dynamics technology to help expand its system analysis offerings.

Time, Space, Structure, and Model Analysis of CCL Price Increase

04/19/2021 | Hu Yang, Zhongtai Securities Research Center
According to the CCL Association, copper foil accounts for the largest proportion of raw materials (traditional CCL uses epoxy resin, glass fiber cloth and copper as raw materials). Copper foil in thin plate accounts for about 30% of the overall cost; in thick plate copper accounts for 50%. In CCL production, using Shengyi Technology and Chaohua Technology as examples, the cost of raw materials accounts for about 88% of the total cost, with labor accounting for about 4%. Other costs such as equipment depreciation account for about 8%.

PCB Sourcing Using PCQR2

03/30/2021 | Al Block, Naji Norder, and Chris Joran, National Instruments
In a global market, it is often difficult to determine the best PCB suppliers for your technology needs, while also achieving the lowest costs for your products. Considering each PCB supplier has their own niche in terms of equipment, process, and performance, uniform test data from the IPC-9151D Process Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard can help find the right source for the board based on its specific technology requirements.

Copyright © 2021 I-Connect007. All rights reserved.