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Miniaturization Continues: Day 3 productronica Coverage
November 15, 2019 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
The conversations on day 3 of productronica continued, including topics such as flexibility, 5G capabilities, and increased data and intelligence. The theme from test and inspection equipment providers included increased capabilities in sensing, material handling, and visual inspection technologies. And through it all, one common perspective emerged time and time again: PCB manufacturing is now approaching the levels of line, trace, and component density that were once limited to the surface of a silicon wafer.
What was once a level of precision relegated to the smooth, mirror-like surface of a wafer slice and then sealed in a package, now is expected upon the relatively rough, uneven, and flexible surface of today’s newest materials. Organizations—equipment manufacturers, university research consortia, industry standards organizations, and more—are all collaborating to bring these capabilities to PCB fabrication.
On Thursday, I-Connect007 caught up with the likes of Isola, Koh Young, CyberOptics, ESI, PVA, Mirtec, Hitachi High-Tech, Indubond, Vayo Technology, Meyer Burger, Agfa, Polar, Rogers, and Orbotech. We also report on the IPC Hand Soldering World Championships, which concluded—with much excitement—Thursday afternoon. We will have coverage of the event and the awards ceremony soon.
One more day of productronica coverage still to come.
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03/28/2024 | Andy Shaughnessy, Design007 MagazineI recently spoke with a few technologists who have first-hand experience with PCBflow: Susan Kayesar, technical product manager with Siemens; Evgeny Makhline, CTO of Nistec, a CEM based in Israel; and Peter Tranitz, senior director of technology solutions and leader of the IPC Design Initiative. They explain how PCBflow functions, from the designer’s and manufacturer’s viewpoint, and how this database helps break down the wall between these stakeholders.
ASMPT to Exhibit Smart Manufacturing at IPC APEX EXPO 2024
03/27/2024 | ASMPTWith its innovative, data-driven Intelligent Factory concept and a comprehensive hardware and software portfolio around SMT production, market and innovation leader ASMPT will be a major presence at the IPC APEX EXPO 2024, the industry’s main event in California.
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.
TRI Launches New Advanced Packaging 3D CT AXI Solution
03/26/2024 | TRITest Research, Inc. (TRI) proudly announces the launch of the SEMI 3D CT AXI solution, TR7600F3D SII Plus, marking a paradigm shift in precision and reliability for high-reliability electronics manufacturing, such as the Advanced Packaging Industry.
Blackfox Ready for IPC APEX EXPO 2024
03/26/2024 | Andy Shaughnessy, I-Connect007Blackfox Training Institute offers IPC-certified training for a myriad of PCB assembly techniques and standard certifications. With many technologists beginning to eye retirement, this training is at a premium. I recently spoke with Jamie Noland, director of training and education for Blackfox, about the company’s latest educational efforts, and his plans for the upcoming IPC APEX EXPO, where Blackfox will be exhibiting.