Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Miniaturization Continues: Day 3 productronica Coverage
November 15, 2019 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
The conversations on day 3 of productronica continued, including topics such as flexibility, 5G capabilities, and increased data and intelligence. The theme from test and inspection equipment providers included increased capabilities in sensing, material handling, and visual inspection technologies. And through it all, one common perspective emerged time and time again: PCB manufacturing is now approaching the levels of line, trace, and component density that were once limited to the surface of a silicon wafer.
What was once a level of precision relegated to the smooth, mirror-like surface of a wafer slice and then sealed in a package, now is expected upon the relatively rough, uneven, and flexible surface of today’s newest materials. Organizations—equipment manufacturers, university research consortia, industry standards organizations, and more—are all collaborating to bring these capabilities to PCB fabrication.
On Thursday, I-Connect007 caught up with the likes of Isola, Koh Young, CyberOptics, ESI, PVA, Mirtec, Hitachi High-Tech, Indubond, Vayo Technology, Meyer Burger, Agfa, Polar, Rogers, and Orbotech. We also report on the IPC Hand Soldering World Championships, which concluded—with much excitement—Thursday afternoon. We will have coverage of the event and the awards ceremony soon.
One more day of productronica coverage still to come.
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