Quik-Pak Acquires Wafer-Preparation Firm QBBS
November 25, 2019 | Globe NewswireEstimated reading time: 2 minutes
Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions, today announced it has acquired Santa Clara-based QBBS to broaden its portfolio of wafer-preparation services. The addition of QBBS’s automated back-grinding capability will enable Quik-Pak to process customer wafers in larger volumes. The deal was finalized on November 1, and Quik-Pak will integrate the QBBS technology into its wafer prep line in early January.
The QBBS technology will allow Quik-Pak to perform automated, volume back-grinding of a cassette containing up to 25 whole wafers, from 100mm to 200mm (4 to 8 inches) in diameter, as well as partial wafers and 300mm (12-inch) quartered wafers. Quik-Pak will continue to offer its existing backgrinding services, including thinning wafers as large as 300mm in diameter down to 75 microns, and wafers up to 200mm down to 25 microns (about a third the width of a human hair).
“This acquisition is highly complementary to our existing wafer thinning, dicing and die inspection business,” said Quik-Pak Chief Operating Officer Ken Molitor. “We have had a relationship with QBBS for many years, tapping them to accommodate customers who needed volume back-grinding services. Being able to deliver this capability directly will greatly enhance our customer relationships and allow us to broaden our market reach.”
“Selling the business to Quik-Pak was the right decision at the right time,” noted Carmen Perry, QBBS founder and CEO. “We sought an appropriate exit strategy, and Quik-Pak is on a strong growth path. Our technology and customer base are an excellent fit, and I’m pleased that we were able to strike a mutually beneficial agreement with our longtime partner and proven industry leader.”
According to market research firm Mordor Intelligence, the global market for thin wafer processing and dicing equipment reached US$504.3 million in 2018 and is expected to increase at a CAGR of 6.44 percent between 2019 and 2024. Factors driving the growth in demand for these back-end packaging services include the heightened use of RFID chips in consumer, industrial and other electronics applications and the rapid upsurge in IoT and connected devices.
About Quik-Pak
Quik-Pak, a division of Promex Industries, provides IC packaging, assembly and wafer preparation services in its ISO 9001:2015-certified, ITAR-registered facility in San Diego, Calif. The company’s over-molded QFN/DFN packages and pre-molded air cavity QFN packages provide a fast, convenient solution for prototype to full production needs. Same-day assembly services are provided to reduce time to market. More information is available at www.quik-pak.com.
Suggested Items
StenTech Discusses Revolution of Stencil Manufacturing with Laser Technology at SMTA Guadalajara
09/25/2023 | StenTechStenTech Inc., the leading multinational SMT Printing Solutions company, is pleased to announce plans to exhibit at the SMTA Guadalajara Expo, scheduled to take place Oct. 25-26, 2023 at the Expo Guadalajara in Guadalajara, Jalisco, Mexico.
Quantum Computing Startup-Nanofiber Quantum Technologies Secures $8.5m Funding
09/22/2023 | ACN NewswireNanofiber Quantum Technologies Inc. raised $8.5m from leading venture capital investors. Phoenix Venture Partners (PvP) in the US, and Japan's JAFCO Group Co Ltd, SPARX Group Co Ltd, Keio Innovation Initiative, Inc. (KII), and Waseda University Ventures (WUV) financed the round through convertible notes.
Welcome Hayden Dalton as ViTrox’s New On-Board Field Support Engineer in The US Region
09/21/2023 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is pleased to announce the addition of Hayden Dalton to our team as a Field Support Engineer who based in Milwaukee, WI, effective August 21, 2023.
Qualcomm Unveils 10G Fiber Gateway Platform for Ultimate Connected Home Performance
09/20/2023 | Qualcomm Technologies, Inc.Qualcomm Technologies, Inc. is ushering in a new era of home connectivity, and new opportunities for service providers, with the introduction of the Qualcomm® 10G Fiber Gateway Platform and its signature feature, Qualcomm® Service Defined Wi-Fi technology.
MIRTEC to Display Award-Winning 3D AOI and SPI Solutions at the SMTA Guadalajara Expo 2023
09/19/2023 | MirtecMIRTEC, ‘The Global Leader in Inspection Technology’, is pleased to announce its participation in the upcoming SMTA Guadalajara Expo on Wednesday, Oct. 25, 2023.