-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueWet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
DuPont Introduces New Pyralux and Riston Products
February 3, 2020 | DuPontEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/7816/3132/9804/new-icon.jpg)
DuPont Interconnect Solutions announced today that it is introducing several new products across its DuPont™ Pyralux® and Riston® product families to address a diverse set of needs for both the manufacture and performance of advanced electronics devices. DuPont will showcase these new products and many other innovations at the upcoming IPC APEX tradeshow in San Diego, California, Feb. 4-6, booth #4118.
“DuPont Interconnect Solutions is focused on helping our customers push performance boundaries, while also meeting complicated processing demands,” said Andy Kannurpatti, West Business Leader, DuPont Interconnect Solutions. “With the introduction of these newest products, we are demonstrating again our resolve to create novel solutions that meet the needs of our customers today and in the future.”
DuPont’s newest product innovations include:
- Pyralux® AG – an all-polyimide double sided copper clad laminate that is offered in both sheets and rolls with global availability and is ideal for use in high volume consumer, medical and automotive applications.
- Pyralux® GPL – an adhesive that is specifically formulated for high-speed, high-frequency flexible circuit applications; it has outstanding thermal resistance, peel strength and UV laser drilling process capability.
- Riston® DI3000 – multi-wavelength, dry-film photoresist for pattern plating on multi-layer boards. High adhesion and chemical resistance delivers yield by eliminating lifting and breakdown defects in copper, tin or gold.
- Riston® DI5100 – optimum solution for the mSAP process. Made for smooth copper high adhesion on isolated resist lines, this film delivers the ultimate high density circuits made today.
- Riston® DI9200 – high density interconnect film for print and etch process. High resolution and adhesion, combined with excellent lamination conformation, ensures high yields. Fast photospeed at multiple LDI wavelengths ensures high productivity.
DuPont Interconnect Solutions brings a deep understanding of materials science to the printed circuit board (PCB) market. We provide materials that support all aspects of PCB manufacturing for many types of PCBs: single- or double-sided boards and flexible, rigid-flex, or rigid configurations.
As a market leader in flexible PCB laminates, dry film photoresists and high-reliability metallization, we allow our customers to push the design envelope and create products that perform faster and more reliably.
Suggested Items
Atotech to Participate at KPCA Show 2024
09/03/2024 | AtotechMKS’ Atotech will participate in this year’s KPCA Show 2024 in Incheon, held at Songdo Convensia from September 4-6, 2024.
Victory Announces Breakthrough in PCB Technology with New Product Launch
08/29/2024 | openPRShenzhen Victory Electronics Technology Co., Ltd., a leader in the printed circuit board (PCB) manufacturing industry, is proud to announce the successful development of a groundbreaking new product.
Connect the Dots: Designing for Reality—Electroless Copper
08/28/2024 | Matt Stevenson -- Column: Connect the DotsRoll up your sleeves because it's time to get messy. In a recent episode of I-Connect007’s On the Line with… podcast, we discussed electroless copper deposition. This process deposits a copper layer into the through-holes and vias of what will eventually be a PCB. Electroless copper deposition feels like a black box to many people. It sort of looks like a black box, too. The boards go in one side, come out the other, and emerge differently. So, let's crack open that black box and look inside.
Maximizing ROI Through Better Wet Process Control
08/20/2024 | I-Connect007 Editorial Team“When things get out of control, the variation in your wet process begins,” says Mike Carano,. “Just because they look like good boards and may even pass electrical test, it does not necessarily mean you have good boards. Once the chemistry is headed toward the right or left side of the process control parameter cliff, the plating is compromised. If the copper is thinner than it should be, when the customer puts it into service, the board may fail after 500 cycles vs. the requisite 1,000 or 2,000 cycles. The root cause issue is that you plated 7/10ths of a mil of copper instead of one-mil of copper because you were not controlling your process. The fact that you passed your own electric test becomes inconsequential.”
The Chemical Connection: Controlling an Alkaline Etch Bath With Low Copper Loading
08/07/2024 | Don Ball -- Column: The Chemical ConnectionThis month, I wanted to continue my discussion on how much process control is actually needed for high-density circuit production. However, in the last month, I have been called on to help with a specific process control problem: how to control an alkaline etch bath when you’re not etching much copper. This problem has been cropping up more frequently as smaller shops (and a few larger ones) concentrate on low-volume, high-value plated through-hole panels such as prototypes, resistor cores, etc.