With DIS, Accurate Registration is Everything
March 30, 2020 | Real Time with...IPCEstimated reading time: Less than a minute
During IPC APEX EXPO 2020 in San Diego, California, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.
In this video interview from the show, Technical Editor Pete Starkey and Jesse Ziomek, VP of sales for DIS, discuss how the company achieves ultimate accuracy in layer-to-layer registration, not just in rigid multilayers, but also in flex and rigid-flex builds. Jesse also comments on keeping technology exciting enough to attract young engineers into the industry.
IPC APEX EXPO is the largest PCB industry event in North America. The next IPC APEX EXPO is planned for January 26-28, 2021, at the San Diego Convention Center.
To watch this interview, click here.
Suggested Items
Green Tech Accelerator: Tackling Water Resource Challenges and Unlocking Renewable Energy Opportunities
12/26/2024 | BUSINESS WIREGreen Tech Accelerator collaborates with startups, offering courses, mentorship, and international market strategies to implement and validate carbon reduction solutions. This Taiwanese initiative empowers SMEs to progress toward net-zero emissions.
Compal Adopts Intel Tech for Innovative Liquid Cooling Solutions
12/26/2024 | Compal Electronics Inc.Compal Electronics, a leading server solution provider, announced today its collaboration with Intel, BP Castrol (Castrol), JWS, and Priver to launch a groundbreaking liquid cooling solution based on Intel’s Targeted Flow technology. Designed specifically for high-density servers and AI data centers, this innovative solution aims to drive the industry toward a more efficient and sustainable future.
Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.
12/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up to $407 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
SMT Mounter Market Size Projected to Reach $5.06 Billion by 2030
12/23/2024 | openPRAccording to the new market research report "Global SMT (Surface-mount Technology) Mounter Market Report 2024-2030", published by QYResearch, the global SMT (Surface-mount Technology) Mounter market size is projected to reach USD 5.06 billion by 2030, at a CAGR of 4.7% during the forecast period.
Apple’s Vision Pro Reshapes the VR/MR Landscape, Driving Applications from Entertainment to Productivity Tools
12/23/2024 | TrendForceTrendForce’s latest report estimates that global shipments of VR and MR headsets are expected to reach approximately 9.6 million units in 2024, representing a YoY increase of 8.8%.