HP and BASF Expand Industrial Alliance to Advance Digital Manufacturing
June 5, 2020 | Globe NewswireEstimated reading time: 3 minutes

BASF, the world’s leading chemical company, and HP, the leader in industrial 3D printing solutions, today announced an expansion of their strategic alliance to advance digital manufacturing. Together, the companies are working closely with innovators in the auto, consumer, medical, and industrial manufacturing sectors to open up new market opportunities, jointly develop new best-in-class applications, and achieve unmatched quality, breakthrough economics, and more sustainable production.
At the center of the expanded collaboration is the launch of a first-of-its-kind polypropylene (PP) for additive manufacturing. The HP 3D High Reusability PP enabled by BASF was developed and qualified for HP’s Jet Fusion 5200 Series 3D printing solution to enable companies across industries to design and produce 3D printed parts faster, more cost-effectively, more sustainably, and at higher volumes than ever before.
“The advancement of our long-standing partnership with HP truly demonstrates our shared vision to help transform industries, enable sustainable production, and enable our customers to shape the Additive Manufacturing industrialization,” said François Minec, Managing Director, BASF 3D Printing Solutions. BASF 3D Printing Solutions unveiled its new Forward AM brand last year as it continues to pursue its goal of driving industrial scalability with future-oriented, leading-edge materials and technology. “The introduction of PP is another important step as we collaborate on best-in-class materials to transform manufacturing. Our teams have worked closely to develop a high quality, sophisticated PP that fully leverages the advanced capabilities of HP’s Jet Fusion 5200 platform – truly a win-win for innovative companies investing in the shift to digital manufacturing.”
“HP and Forward AM by BASF share a deep commitment to accelerating the shift to digital manufacturing by delivering innovative, sustainable solutions and materials that open up entirely new opportunities,” said Ramon Pastor, Interim President of 3D Printing and Digital Manufacturing, HP Inc. “The powerful combination of the world’s leading materials science and most advanced 3D printing capabilities yields superior quality, reliability, workflow, and cost savings for customers. From advanced prototyping to the production of final parts, we are excited about the impact this new PP will have for designers, engineers, and businesses around the world.”
BASF and HP have a long history of innovating together. BASF is a foundational partner in HP’s 3D printing materials ecosystem and the two companies have collaborated on an array of sustainable and innovative materials including ULTRASINT® TPU01 thermoplastic polyurethane released last year. Developed for HP’s Jet Fusion 5200 3D Series, the new PP enables the 100% reuse of collected surplus powder2, leading to less waste3 and more efficient production.
Already, the Forward AM team and HP are working with industry leaders including Extol, GKN Powder Metallurgy/Forecast 3D, Henkel, Oechsler, and Prototal to jointly develop applications with the new PP on HP Jet Fusion 5200 3D printing systems. Polypropylene has historically been a highly desirable material in industrial manufacturing due to its low cost, colorability, chemical resistance and UV stability, with nearly unlimited use in the world’s leading industries including consumer appliances and the $2 trillion automotive market. The availability of a new additive material that replicates a traditional material used for a wide variety of auto parts found in vehicles’ interior, exterior, and under-the-hood offers significant advantages for auto makers.
“We have been truly impressed by the joint effort between Forward AM by BASF and HP to help us accelerate our digital manufacturing initiatives,” said Matthias Weißkopf, senior vice president for research and development, Oechsler AG. “The introduction of new materials such as PP enables us to quickly and cost effectively design, iterate and produce innovative new 3D printed parts for customers across industries. We expect a fast ramp up of entirely new applications that leverage the inherent advantages that 3D printing provides for auto makers, home and commercial appliances and the medical industry.”
Suggested Items
The Test Connection Inc. Appoints USM Reps as Exclusive Sales Representative in Mexico
05/13/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the appointment of USM Reps as its exclusive sales representative in Mexico.
Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand
05/13/2025 | Prashant Patel -- Column: Facing the FutureInnovations that push the boundaries of connectivity shape the future of technology, processing power, and miniaturization. 5G and emerging 6G technologies are critical in transforming industries from telecommunications and healthcare to autonomous systems. This affects the printed circuit board (PCB) industry, where demand for high-performance, miniaturized, and advanced PCBs is surging. This column explores the key applications of 5G and beyond, the challenges in designing high-frequency PCBs, the effects of miniaturization, industry collaborations, and opportunities for North American companies in this space.
Industrial Robotics Market is Set to Surpass Valuation of $235.38 Billion by 2033
05/12/2025 | Globe NewswireThe global Industrial robotics market was valued at US$ 26.99 billion in 2024 and is expected to reach US$ 235.28 billion by 2033, growing at a CAGR of 27.2% over the course of forecast period, 2025–2033.
SEMI Applauds New Bill to Clarify Tax Credit Eligibility for Critical Semiconductor Suppliers Under U.S. CHIPS Act
05/12/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced support of the Strengthening Essential Manufacturing and Industrial Investment Act (SEMI Investment Act), which clarifies that critical materials suppliers to semiconductor manufacturers are eligible for the Advanced Manufacturing Investment Tax Credit (“Section 48D”) created by the United States CHIPS and Science Act.
TT Electronics Secures £50 Million in New Contract Awards for Classified U.S. DoD Defense Programs
05/12/2025 | TT ElectronicsTT Electronics, a leading provider of global manufacturing solutions and engineered technologies, announced today that it has been awarded significant new contracts totalling over £50 million to support classified U.S. Department of Defense (DoD) programs.