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Matrix Electronics is pleased to announce the completion of a new larger flexible circuit materials conversion center at its Santa Ana, CA location. This new larger facility will accommodate our growth and improve productivity with state-of-the-art automated processing equipment. The Flexible Circuit Materials Center of Excellence will support the Panasonic Felios polyimide flex, LCP and Matrix Plus coverlay materials.
Bob Berg, Vice President Business Development and Product Manager for the Matrix flex line adds: “The Matrix flex materials business has grown dramatically over the past few years and has outpaced the current conversion center at our Santa Clara, CA location. The market leading Panasonic Felios product line has provided a true performance and value driven option to fabricators in North America. OEM and flex fabricator market acceptance of over the past several years has been exceptional and has driven this dramatic growth. Matrix continues to support the flex materials business segment with our proven business model of large in-stock inventories, quick turn lead times, competitive pricing, and exceptional customer support. We look forward to celebrating this new facility with an open house in the Fall with our customers.”
Stan Farnsworth, NovaCentrix
It’s no secret that electronics products are being asked to do more, pushing the boundaries of technological capabilities. Next-gen consumer products like flexible wearables and foldable mobile devices are proving themselves to be more than a fad, with start-ups and major companies alike booming on the market for the past few years.
Sean Nachnani, NextFlex
Emerging innovations in the flexible hybrid electronics (FHE) domain are enabling new applications across multiple industries due to their highly flexible structures and additive manufacturing processes. The smaller form factor, lighter weight, and conformal capabilities are ideal for IoT edge devices in health and fitness monitoring, military asset identification and tracking, automotive displays and sensors, aerospace radar, and soft robotics. Significant industry research led by NextFlex is optimizing the processes from design through manufacture for FHE products.
I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Omni PCB President Tara Dunn’s turn! A regular Flex007 columnist, Tara discusses flexible circuits, rigid-flex, and rigid PCBs, as well as RF/microwave technology, microelectronics, and additive processes. Tara is the co-founder of Geek-a-Palooza and a show manager for the SMTA Additive Electronics TechXchange event. She has over 20 years of experience in the PCB industry. We hope you enjoy “Just Ask Tara.”