Microchip Delivers the Smallest Automotive maXTouch Controllers for Smart Surfaces and Multi-Function Displays
June 30, 2020 | Globe NewswireEstimated reading time: 2 minutes
To help enhance and ease today’s driving experience, automotive manufacturers are implementing additional touch displays beyond the center infotainment display (CID). Supporting the application of these secondary displays with advanced features, Microchip Technology Inc. announced the extension of its market-leading maXTouch® portfolio with the new MXT288UD touch controller family, the industry’s smallest automotive grade packaged touch screen controllers. The MXT288UD-AM and the MXT144UD-AM devices offer low power mode, weatherproof operation and glove touch detection in multi-function displays, touch pad and smart surfaces for vehicles, motorcycles, e-bikes and car-sharing services.
Secondary touch surfaces can be placed in both the interior of cars and exterior of a motor vehicle, such as handlebars, doors, electronic mirrors, control knobs, the steering wheel, between seats or in an armrest. With the MXT288UD family’s small 7x7 mm automotive grade VQFN56 package, tier one suppliers can now reduce board space by 75 percent and greatly minimize the overall Bill of Materials (BoM) for these compact applications — all while exceeding the requirements for excellent and reliable touch performance in the market. The family’s low power wait-for-touch mode consumes less than 50 µA, remaining responsive for the user, even if the display switches off to save power or to avoid disturbing the driver at night. The system will wake by a touch event anywhere on the touch surface.
In addition, the MXT288UD-AM and the MXT144UD-AM devices enable detection and tracking of multi-finger thick gloves through a wide variety of overlay materials and thicknesses, like leather, wood or across uneven surfaces — even in the presence of moisture. Normally the dielectric constant of these overlay materials would limit the detection of the touch, however these devices provide a unique solution to reliably detect and track multi fingers with a high signal-to-noise ratio (SNR) and through a proprietary differential mutual acquisition scheme. For example, in car sharing applications, this reliable touch functionality helps users access a car from the outside by tracking touch coordinates on an exterior display in any environment, like rain, snow or extreme heat. Motorcycles and other motorbike vehicles also benefit from such weatherproof designs. As a turnkey solution, the MXT288UD family provides proven firmware, developed according to Automotive SPICE® processes and is AEC-Q100 qualified — making it easy for today’s automotive manufacturers to integrate into existing systems at a lower risk with faster time to market.
“Automotive OEMs are looking to enhance the user experience through smart surfaces and multi-function displays, while still providing a convenient and distraction free environment,” said Fanie Duvenhage, vice president of Microchip’s human machine interface and touch function group. “Addressing these needs in the market, Microchip is building on its already leading portfolio of automotive touchscreen solutions with the new MXT288UD touch controller family — bringing increased performance and cost savings to the industry’s smallest package of automotive grade touch controllers.”
Development Tools and Design Services
Both software and hardware support are available. Software tools includes maXTouch Studio and a maXTouch analyzer. For the MXT288UD, the hardware offered includes an evaluation kit with a printed circuit board (PCB) and a 5” capacitive touch panel, while the MXT144UD’s evaluation kit includes a PCB and a 2.9” capacitive touch pad. For both devices, a bridge PCB is included with a USB connection for interfacing to a computer when running maXTouch Studio.
To help with the development and tuning of touch sensors and integration into the final application, Microchip’s touch function group and field application engineers provide best-in-class, worldwide support.
Suggested Items
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
MVTec, Siemens Expand Technological Cooperation
06/12/2025 | MVTecMVTec Software GmbH and Siemens are expanding their technological cooperation in the field of industrial automation. To reinforce their increasingly close collaboration, Siemens joined the MVTec Technology Partner Program in May 2025.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd