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DuPont Sets the Stage for Electronics Innovation at DesignCon 2025 Expo

01/29/2025 | DuPont
DuPont, a leader in advanced material solutions and technologies, proudly announces its participation at DesignCon 2025 Expo, taking place January 29 - 30 in Santa Clara, California.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... High Performance Materials, Chapter 4

01/02/2025 | I-Connect007
In Chapter 4, Michael Gay discusses the two main types of copper foil used for PCB boards today: electrodeposited (ED) foil and rolled annealed (RA) foil. He also explains the pros and cons of each, and provides an update of the latest innovations in copper foil technology.

Trouble in Your Tank: Materials for PWB Fabrication—Drillability and Metallization

07/16/2024 | Michael Carano -- Column: Trouble in Your Tank
Laminate materials are the building blocks on which printed circuit boards are manufactured. Circuit board designers rely on the critical electrical properties of the materials to design the interconnects, and with the drive toward IoT (internet of things), autonomous driving, and virtual and augmented reality, material properties take on a very high level of importance.

Don’t Overconstrain Your Board Materials

07/02/2024 | I-Connect007 Editorial Team
When we started planning May’s issue, which centers on the use of traditional laminates in certain high-frequency PCBs, we knew we had to interview Kris Moyer and Ed Kelley together. Kris teaches advanced PCB design classes for IPC, and Ed is the former CTO of Isola and founder of Four Peaks Innovation. What ensued was a wide-ranging discussion on the evolution of “standard” PCB laminates and the recent trend by some OEMs to use these materials in high-frequency and even RF boards.

Underconstraining Your Materials? Leave It to the Experts

05/30/2024 | I-Connect007 Editorial Team
With traditional laminates now sporting improved resin systems, some OEMs are choosing various flavors of FR-4 instead of high-speed laminates for their high-speed designs—even RF applications. Avoiding overconstraining your materials in high-speed products can lead to considerable cost savings, not to mention a more streamlined trip through fabrication.
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