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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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TSK Schill GmbH Supplies Rohde & Schwarz with New Chemical Tin Line
September 18, 2020 | TSK Schill GmbHEstimated reading time: Less than a minute

After on-schedule delivery and successful installation of a horizontal chemical tin line at Rohde & Schwarz’s Teisnach plant, the customer is now equipped for the future. TSK has also succeeded in implementing the requirements of this project with high precision and quality. The new line is now in the qualification phase.
Thanks to the renewed extraordinarily good cooperation and planning between Rohde & Schwarz and TSK, this joint project was successfully implemented.
"We are again very proud to have implemented another project with Rohde & Schwarz and look forward to future projects," says Managing Director Thomas Schill.
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