It’s Only Common Sense: Customer Service Is Sales in Disguise
Dan’s Biz Bookshelf: ‘Dream First, Details Later
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
Onto Innovation Acquires Inspectrology, Adds Overlay Metrology Capability
January 11, 2021 | Onto Innovation Inc.Estimated reading time: 2 minutes
Onto Innovation Inc. has acquired Inspectrology, LLC. Headquartered in Sudbury, Massachusetts, USA, Inspectrology is a leading supplier of overlay metrology for controlling lithography and etch processes in the compound semiconductor market.
“This is a nice strategic fit for Onto Innovation’s portfolio of solutions for the high growth specialty and advanced packaging segment. We see revenue synergies by leveraging our broader access to global markets, especially in Asia, where Onto Innovation has built a broad infrastructure to support our leading position in inspection for this segment. In addition, we see revenue synergies when combined with Onto Innovation’s inspection and software technologies. By combining these technologies, we will offer a more comprehensive process control solution for the lithography cell in the rapidly expanding compound semiconductor market,” said Mike Plisinski, Onto Innovation’s chief executive officer.
Dr. Ju Jin, vice president and general manager of Onto Innovation’s inspection business said, “We see several growth drivers for the compound semiconductor and specialty semiconductor markets in 2021 and beyond. The rapidly expanding 5G wireless technology, spanning from smartphones and IoT to network equipment and base stations, is increasing the demand for compound semiconductor chips such as power amplifiers, RF filters, and mmWave cells. In addition, hybrid and electric vehicles, chargers, photovoltaic and wind power generators are driving the fast adoption of compound semiconductor power devices.
“Based on industry forecasts, the gallium nitride and silicon carbide power device market is forecasted to grow at a 25% CAGR from 2020 to 2025. By leveraging our advanced process control software (APC) and the Inspectrology systems we will be able to directly improve the overlay performance and yield for the lithography cells in this rapidly growing market.”
Paul Knutrud, Inspectrology’s chief financial officer and vice president said, “We are joining Onto Innovation based on the strong cultural fit and synergies between our customers and technologies. As a leading supplier for overlay and CD metrology systems to the compound semiconductor, RF, MEMS, and LED markets, the Inspectrology and the Onto teams are a perfect fit. Onto Innovation is providing inspection and software solutions to our same customers, and together, we will offer a more comprehensive solution for process control. We will now be able to leverage Onto Innovation’s R&D resources and larger customer support organization to better serve our customers.”
The experienced Inspectrology leadership team has supplied optical metrology overlay technology to these customers since 1983. The purchase price represents 1.4x Inspectrology’s 2020 revenue of approximately $20 million. The acquisition and associated transaction expenses are being funded from Onto Innovation’s cash on hand. Other terms of transaction were not disclosed.
Share on:
Suggested Items
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/15/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
The Knowledge Base: A Conference for Cleaning and Coating of Mission-critical Electronics
07/08/2025 | Mike Konrad -- Column: The Knowledge BaseIn electronics manufacturing, there’s a dangerous misconception that cleaning and coating are standalone options, that they operate in different lanes, and that one can compensate for the other. Let’s clear that up now. Cleaning and conformal coating are not separate decisions. They are two chapters in the same story—the story of reliability.
SMT007 Magazine July—What’s Your Competitive Sweet Spot?
07/01/2025 | I-Connect007 Editorial TeamAre you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche—what are their insights? In the July 2025 issue of SMT007 Magazine, we spotlight companies thriving by redefining or reinforcing their niche and offer insights to help you evaluate your own.
Smarter Machines Use AOI to Transform PCB Inspections
06/30/2025 | Marcy LaRont, PCB007 MagazineAs automated optical inspection (AOI) evolves from traditional end-of-process inspections to proactive, in-line solutions, the integration of AI and machine learning is revolutionizing defect reduction and enhancing yields, marking a pivotal shift in how quality is managed in manufacturing.