Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Trump Administration Secures an Additional $100B U.S. Semiconductor Manufacturing Investment for a Total of $265B from TSMC

07/16/2026 | U.S. Department of Commerce
As a result of the historic deal related to U.S. and Taiwan Trade and Investment announced in January 2026, TSMC has just announced an incremental $100 billion investment for a total of $265 billion in the U.S

TSMC Reports Second Quarter EPS of NT$27.25

07/16/2026 | TSMC
TSMC announced consolidated revenue of NT$1,270.38 billion, net income of NT$706.56 billion, and diluted earnings per share of NT$27.25 (US$4.31 per ADR unit) for the second quarter ended June 30, 2026.

Zuken Joins TSMC’s Open Innovation Platform® EDA Alliance

07/08/2026 | Zuken
Zuken Inc. announced that it has joined the EDA Alliance in TSMC’s Open Innovation Platform® (OIP).

TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the US

06/16/2026 | BUSINESS WIRE
Taiwan Semiconductor Manufacturing Company and Amkor Technology, Inc. announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor packaging capabilities in Arizona, strengthening and accelerating investment in the U.S. semiconductor supply chain ecosystem.

TSMC to Sell 8.1% of Vanguard International Semiconductor

05/15/2026 | TSMC
TSMC plans to execute the sale of up to 152.0 million common shares of Vanguard International Semiconductor Corporation (VIS), or approximately 8.1% of VIS’ fully-diluted paid-in-capital through a block trade to financial institutional investors.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in