Trouble in Your Tank: Yield Improvement and Reliability
Dan's Biz Bookshelf: 'The Sale'
The Marketing Minute: Wired for Trust
Ucamco Announces Simultaneous Releases for UcamX and Integr8tor v2020.12
February 15, 2021 | UcamcoEstimated reading time: 1 minute
Ucamco announced that moving forward they will release new versions of their flagship products, UcamX and Integr8tor, simultaneously.
Below are lists of the most significant improvements, as well as relevant documents and videos detailing the two releases. But first ...
Why release simultaneously?
As more and more customers are programming their entire daily processes around Ucamco software, looking to achieve maximum automation, the company decided to make sure the base code is perfectly matched. The best way to do that is to release both UcamX and Integr8tor at the same time, allowing for maximum optimization of all processes.
UcamX v2020.12
- DPMX Import
- YELO Copper Adjuster extensions
- Text Updater
- SEC Horn Compensation
- Auto Markup extensions
- YELO Legend Adjuster extensions
- YELO Mask Adjuster (including Tombstone and Solder Escape prevention)
- Job Editor extension
- Smart Products extensions
- Drill Tool Manager extension
- Copper Repair extension
- ODB++ Import extensions
Integr8tor v2020.12
- QED analysis for backdrilled PCBs
- Altium PCB Input Connector
- DPMX (IPC-2581) data input
- QED conditional formatting based on copper weights
- Per-layer finished and base copper weights in QED
- Registration of the interactive time spent on a job
- Cockpit user auto log-off
- Assembly panel rout length analysis
- Addition of extra surface finishes and solder mask colors
- QED Solder Mask analysis extensions
- Annotated QED PDF
- QED PDF Summary table revision
Visit the download section of the Ucamco website for…
- The complete release overview
- A more elaborate explanation in video
- A list of code changes and fixes
UcamX v2020.12 and Integr8tor v2020.12 are now available for download. Ucamco recommends upgrading to the new versions at the earliest possible convenience.
Customers with software under warranty or covered by a maintenance contract can pick up this version free of charge from the Ucamco FTP download server using regular credentials. As most internet browsers have stopped supporting FTP download, Ucacmo recommends using FTP client to do so.
If you wish to upgrade to this version outside of a maintenance contract or wish to take out a maintenance contract, please contact your local sales channel or send an email with your request for quotation to presales@ucamco.com.
Share on:
Suggested Items
KYZEN to Focus on Aqueous Cleaning and Stencil Cleaning at SMTA Juarez
05/20/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Juarez Expo and Tech Forum, scheduled to take place Thursday, June 5 at the Injectronics Convention Center in Ciudad Jarez, Chihuahua.
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.