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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
The Automation Advantage
In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
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This month, we give thanks to our columnists—the brilliant minds who share their expertise, experiences, and passion for the PCB industry. Meet the people behind the pages, learn what drives them, and discover their personal stories.
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Nan Ya PCB Posts 40% YoY Revenue Growth in May
June 4, 2021 | Nan Ya Printed Circuit Board Corp.Estimated reading time: Less than a minute
Taiwan-based PCB manufacturer Nan Ya Printed Circuit Board Corp. has posted sales of NT$4.1 billion ($148.1 million at $1=NT$27.68) in May 2021, slightly down by 0.4% from the previous month, but up by 40% from May of last year.
For the first five months of the year, Nan Ya PCB—whose products include single-sided PCBs, HDI PCBs, and rigid-flex PCBs for motherboards, desktop and notebook PCs, home appliances, smartphones, and gaming consoles—achieved cumulative sales of NT$19 billion ($689.88 million), up by 38.6% compared to the same period in 2020.
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Brent Fischthal - Koh YoungSuggested Items
CPCA, KPCA Join Hands with Korean Enterprises to Visit Henger Microelectronics Workshop
01/23/2026 | HengerRecently, representatives from Korean electronics companies visited our factory for an on‑site tour and technical exchange.
Jabil Announces Appointment of New Chairman, Directors to the Board
01/23/2026 | JabilJabil Inc., a global engineering, supply chain, and manufacturing solutions provider, announced that Steve Raymund has been appointed Chairman of its Board of Directors. Additionally, Thomas T. Edman and Raejeanne Skillern have been appointed to its Board of Directors.
FLEX Technology Summit 2026 Spotlights Augmenting Flexible Hybrid Electronics with AI, Digital Twins, and XR
01/23/2026 | SEMIThe FLEX Technology Summit will be held on February 24-26, 2026, at the Wigwam Arizona Resort in Phoenix, Arizona, celebrating 25 years of innovation in flexible hybrid electronics (FHE), printed electronics, and advanced packaging.
What’s Next for Global Electronics: A 2026 Outlook from East Asia
01/23/2026 | Sydney Xiao, Global Electronics Association East AsiaThis is the latest entry in our ongoing blog series, where Global Electronics Association experts explore the forces shaping the future of the global electronics industry.
New IPC-6921 Standard Sets Requirements and Acceptance Criteria for Organic IC Substrates
01/23/2026 | Global Electronics AssociationThe Global Electronics Association has officially released IPC-6921, Requirements and Acceptance for Organic IC Substrates.