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Ansys Collaborates with TSMC and Microsoft to Accelerate Mechanical Stress Simulation for 3D-IC Reliability in the Cloud

11/20/2023 | ANSYS
Ansys has collaborated with TSMC and Microsoft  to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems manufactured with TSMC’s 3DFabric™ advanced packaging technologies.

Ansys Collaborates with Sony Semiconductor Solutions to Advance Next-Generation Simulation of Automotive Image Sensors

11/10/2023 | PRNewswire
Ansys collaborated with Sony Semiconductor Solutions (Sony) to enhance high-fidelity image sensor simulation and camera-based features in next-generation automotive applications, including AV and ADAS.

Ansys Announces Financial Results With Record Q3 Cash Flow and ACV

11/02/2023 | ANSYS
ANSYS, Inc. reported third quarter 2023 GAAP and non-GAAP revenue of $458.8 million, a decrease of 3% in reported currency, or 4% in constant currency, when compared to the third quarter of 2022.

Ansys Continues AI Innovations

11/01/2023 | ANSYS
Ansys is reinforcing its ongoing investment in artificial intelligence (AI) innovation through the upcoming introduction of Ansys SimAI and Ansys AI+ technologies. The upcoming releases build on Ansys’ ongoing expansion of AI integration across its simulation portfolio and customer community.

Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design for TSMC

09/28/2023 | Keysight Technologies, Inc.
Keysight Technologies, Inc., Synopsys, Inc., and Ansys announced a new reference flow for the TSMC N4PRF, the world's leading semiconductor foundry's advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.
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