Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032

09/18/2025 | Globe Newswire
The global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.

Technica USA Advocates for PCBAA Membership Among Printed Circuit Assembly Customers

09/16/2025 | Technica USA
Technica USA is actively encouraging its printed circuit assembly customers to join the Printed Circuit Board Association of America (PCBAA), a leading industry organization advocating for increased domestic production of printed circuit boards (PCBs) and substrates.

Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging

09/17/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
Electronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.

Staying on Top of Signal Integrity Challenges

09/16/2025 | Andy Shaughnessy, Design007 Magazine
Over the years, Kris Moyer has taught a variety of advanced PCB design classes, both online IPC courses and in-person classes at California State University-Sacramento, where he earned his degrees in electrical engineering. Much of his advanced curriculum focuses on signal integrity, so we asked Kris to discuss the trends he’s seeing in signal integrity today, the SI challenges facing PCB designers, and his go-to techniques for controlling or completely eliminating SI problems.

TTM Technologies to Exhibit at the Electronica India 2025 Exhibition in Bengaluru, India

09/16/2025 | Globe Newswire
TTM Technologies, Inc., a leading global manufacturer of technology solutions, including mission systems, radio frequency (RF) components, RF microwave/microelectronic assemblies, and quick-turn and technologically advanced printed circuit boards (PCBs), will exhibit at the Electronica India 2025 trade fair, at Hall 3, booth #H41, from September 17-19, 2025, at the Bangalore International Exhibition Centre, Bengaluru, India.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in