Trouble in Your Tank: Can You Drill the Perfect Hole?
It’s Only Common Sense: Your Guide to Better Time Management
Dan's Biz Bookshelf: 'Move Your Bus'
Innovative Circuits Inc. Chooses atg Flying Probe Technology for High-speed Electrical Test
December 1, 2021 | atg Luther & Maelzer GmbHEstimated reading time: 1 minute
atg Luther & Maelzer GmbH has confirmed an order for high-speed bare board testing technology.
The atg A7, eight-head, double-sided, high-speed flying probe test system has been ordered and installed at Innovative Circuits Inc. in Alpharetta, Georgia.
atg’s A7 testers utilize eight flying probe test heads, multiple optical recognition systems, and a wide variety of advanced, high-speed electrical test measurement techniques to electrically test all types of PCBs for continuity and isolation. Board sizes of 24" x 21" (or larger), with small pad/fine pitch technology can be tested quickly and easily. Special options such as 4-wire Kelvin tests, hi-pot test, latent defect test, and others can be provided.
About atg Luther & Maelzer GmbH
With more than 150 employees worldwide, atg Luther & Maelzer is the leading supplier of electrical testing solutions for the Printed Circuit Board industry. We have solutions for every application regardless of product type, batch size or technology deployed. Our atg flying probe tester products are renowned for Automation, speed, accuracy, versatility and ease of use, while the Luther & Maelzer universal grid tester product range is known worldwide for high throughput, repeatability, gentle handling and precision accuracy. Visit http://atg-lm.com.
About Innovative Circuits
Innovative Circuits is a quick turn, Prototype, high mix, low volume fabricator of Printed Circuit Boards. They specialize in high tech, Mulitlayer rigid PCBs, rigid flex and flex circuits. Clients range from startups to Fortune 500 companies within a wide range of industries including defense, aerospace, medical and industrial electronics. Innovative Circuits Inc. is ISO 9001:2015 and ITAR certified.
Share on:
Suggested Items
Moog Announces Acquisition of COTSWORKS
07/07/2025 | BUSINESS WIREMoog Inc., a worldwide designer, manufacturer and systems integrator of high-performance precision motion and fluid controls and control systems, announced the acquisition of COTSWORKS Inc., an aerospace and defense fiber optics transceiver component manufacturer, for a purchase price of $63 million.
S&K Aerospace Awarded Major Contract Under DLA Maritime Acquisition Advancement Program
07/02/2025 | BUSINESS WIRES&K Aerospace, LLC has been awarded a significant contract under the Defense Logistics Agency’s (DLA) Maritime Acquisition Advancement Program, managed by the U.S. Naval Supply Command - Weapon Systems Support (NAVSUP WSS) in Mechanicsburg, PA.
Green Circuits to Exhibit Full-Service Electronics Manufacturing Solutions at 2025 SMD Symposium
07/02/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce its participation in the 2025 SMD Symposium, taking place August 5-7 at the Von Braun Center in Huntsville, Alabama.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.