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Summit Interconnect VP of Technology to Present at 2022 IPC APEX Expo
January 6, 2022 | Summit Interconnect, Inc.Estimated reading time: Less than a minute
Summit Interconnect is excited to announce that our VP of Technology Gerry Partida will be presenting at the IPC APEX Expo on January 25, 2022.
Gerry’s presentation will cover various topics surrounding microvia reliability. After a successful and interesting presentation at PCB West in October, we are excited for Gerry to present again on important technology problems and solutions.
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Brent Fischthal - Koh YoungSuggested Items
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SCHMID Group Secures Major Orders for AI Server PCB Production Equipment
10/22/2025 | SCHMID GroupSCHMID Group, a global equipment maker and solution provider for Printed Circuit Boards (PCB) and IC-Substrate manufacturing – announced the successful acquisition of two significant orders in the fast-growing field of PCB for artificial intelligence (AI) server applications. So called AI-Server-Boards.
SEMICON Japan 2025 to Spotlight Sustainability in AI and Semiconductor Innovation
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Circus SE Set for High-Volume Market Entry in the Defense Sector
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China Expands Rare Earth Export Restrictions, Tightening Grip on Global Supply Chains
10/16/2025 | I-Connect007 Editorial TeamChina sharply expanded its rare earth export restrictions on Oct. 9, adding additional elements and refining technologies to its control list while imposing stricter rules on foreign users in the defense and semiconductor industries.