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Atotech to Participate at IPC APEX EXPO 2022 and Present Four Technical Papers
January 13, 2022 | AtotechEstimated reading time: 1 minute

Atotech, a leading specialty chemicals technology company and a market leader in advanced electroplating solutions will take part at IPC APEX EXPO 2022 and present four technical papers this year, touching on the following hot industry topics “crystal structures in plated microvias”, “electroless palladium plating”, “Pd-free activation for electroless Cu”, and “nano structuring photoresist adhesion promoter”. For Atotech’s work on analyzing and improving the crystal structures in plated microvias, our technical paper has been selected as Honorable Mention for the 2022 IPC APEX EXPO Technical Conference. Both, IPC APEX EXPO and its accompanying Technical Conference will be held at the San Diego Convention Center in San Diego, CA from January 22 to 27. The Atotech global team will be at booth 3317 to discuss this year’s technical paper presentations, show highlights or to exchange ideas on new technology demands.
The Atotech technical papers at IPC APEX EXPO Technical Conference 2022:
Session 06: "Microvia design and test 2"
Tuesday, January 25, 2022
Time: 1:30 p.m. to 3:00 p.m.
Topic: Recrystallization and the resulting crystal structures in plated microvias” by Roger Massey
Session 14: "Surface finishes & coatings"
Wednesday, January 26, 2022
Time: 10:00 a.m. to 12:00 p.m.
Topic: “Electroless palladium plating – Correlating plating solution and deposit properties” by Gustavo Ramos
Session 18: "High-density interconnects / Semi-additive processes 2"
Wednesday, January 26, 2022
Time: 1:30 p.m. to 3:00 p.m.
Topic: “Palladium-free activation process for electroless copper deposition” by Roger Massey
Session 30: "High speed PCBs & signal integrity considerations"
Thursday, January 27, 2022
Time: 10:00 a.m. to 11:30 a.m.
Topic: “Nano structuring photoresist adhesion promoter for improved signal integrity in the modern HDI-PCB fabrication” by Christopher Seidemann
Please note, IPC and the state of California have strict COVID-19 protocols in place to protect show attendees. Please visit https://www.ipcapexexpo.org/ for more information and for the Atotech show featured click here: IPC download area - Atotech.
For more information about Atotech or its product offering, please visit www.atotech.com
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Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
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MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
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Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
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MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30