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IPC Releases Newest List of Standards Updates, Revisions

09/16/2024 | IPC Community Editorial Team
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q3 2024.

DuPont Showcases Silver Nanowire Technologies at SID Vehicle Displays and Interfaces 2024

09/13/2024 | DuPont
DuPont showcased its unique and advanced silver nanowire technologies at the SID Vehicle Displays and Interfaces 2024. Leveraging its recently acquired assets from C3 Nano, Inc.

Requirements & Systems Portal Application Now Available on the Altium 365 Cloud Platform

09/13/2024 | Altium
Altium, a global leader in electronics design systems, announced today that it has launched the Requirements & Systems Portal Application into the Altium 365 cloud platform for electronics design collaboration.

SEMI, IESA Join to Strengthen Semiconductor Ecosystem at SEMICON India 2024

09/12/2024 | SEMI
In a strategic move to further solidify India's position in the global semiconductor value chain, SEMI®, the global industry association that connects the semiconductor and electronics design and manufacturing value chain, has announced a strategic agreement with the India Electronics and Semiconductor Association (IESA), the leading industry body representing the electronics and semiconductor sectors in India. 

Making Waves With Solder Paste Jetting

09/11/2024 | Josh Casper, Horizon Sales
As electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing.
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