-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueWet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Real Time with… IPC APEX EXPO 2022: The Supply Chain and Markets
February 15, 2022 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
![](https://iconnect007.com/application/files/4916/9086/8971/MarkGoodwin_small.jpg)
Pete Starkey interviews Mark Goodwin, COO of Ventec International Group, on the impact of the current supply chain condition. Their conversation also covers aerospace and the U.S. market.
If you were unable to attend IPC APEX EXPO 2022, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.
Watch this interview below or click here to view on our show page.
Check out this additional content from Ventec International Group:
-
The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates by Didier Mauve and Ian Mayoh (a free eBook available for download)
-
Roundtable Discussion: Use of IMS Thermal Materials in Multilayer Stackups for Power Applications, with Chris Hanson and Denis McCarthy of Ventec, Rax Ribadia of Excello Circuits, and Pete Starkey, I-Connect007 technical editor
-
You can also view other titles in our full I-007e Book library here
Suggested Items
Foxhole Group Boosts Life Science Capabilities with Accutron Partnership
09/03/2024 | Foxhole GroupFoxhole Group, a private investment firm focused on the industrial sector, announced today that it has added significant depth of expertise in life science and aerospace and defense capabilities to its Foxtronics EMS platform by partnering with the Faldu family to add Accutron to the company’s portfolio of EMS brands.
Marshall, Tech Mahindra to Explore Aerospace and Defense Collaboration
09/02/2024 | MarshallMarshall and Tech Mahindra, a leading global provider of technology consulting and digital solutions to enterprises across industries, have signed a Memorandum of Understanding (MoU) to identify and develop opportunities to work together across the aerospace and defense domains.
A Less Expensive Defense and Aerospace PCB Fab Startup
08/20/2024 | Alex Stepinski, Stepinski GroupEditor’s note: Investing in a new printed circuit board fabrication startup is not for the faint of heart or the light of wallet. Standing up a new “high-tech” PCB fab facility capable of becoming qualified for aerospace and defense work typically takes a minimum investment of $50 million. However, Alex Stepinski says entering the defense and aerospace markets with a new PCB fabrication start-up facility far under this prohibitive cost benchmark is possible when good partnerships, innovation, and sound engineering design enter from the beginning. In this article, Alex Stepinski outlines just how this can be achieved.
USPACE and EgSA to Form Aerospace Joint Venture in Egypt
08/16/2024 | PRNewswireUSPACE Technology Group Limited is pleased to announce that the Group has signed the strategic partnership agreement with the Egyptian Space Agency (EgSA), in relation to satellite manufacturing and testing, satellite launch, education and training, greatly expanding its business presence in the fast-growing African space market.
UHDI Fundamentals: UHDI Applications for Aerospace
08/13/2024 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology refers to advanced manufacturing processes used to create extremely compact and highly efficient electronic circuits at the sub-1-mil line and space level. In aerospace applications, UHDI is crucial due to the stringent requirements for weight, reliability, and performance in a challenging environment.