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Indium to Showcase Durafuse Solder Technology at Productronica India

09/02/2024 | Indium Corporation
As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its innovative Durafuse® solder technology at Productronica India, September 11-13, in Delhi, India.

KYZEN to Feature KYZEN E5631J and AQUANOX A4618 at SMTA Michigan Expo and Tech Forum

08/15/2024 | KYZEN'
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Michigan Expo and Tech Forum, scheduled to take place Tuesday, August 27, 2024 at Laurel Manor in Livonia, Michigan.

My Drop Shock Testing Experiments to Determine Reliability in PCBs

08/14/2024 | Palash Vyas, Ph.D, Graduate Research Assistant
Tablets, digital cameras, and smartphones are portable electronics that have become increasingly popular. Compact design and improved functionality are common product and package design trends. However, because they are portable, these devices may fall and cause internal damage. In addition, customers may use products in different environments, exposing them to risks that could cause harm. For example, a smart device such as a phone or tablet could be dropped while being used, or a warehouse shipment could be handled carelessly and fall. Products must have sufficient mechanical shock reliability to reduce the likelihood of damage.

Indium Awards Silver Quill Honor to Authors of Cutting-Edge Technical Content

08/08/2024 | Indium Corporation
Indium Corporation has honored nine of its employees for their technical industry contributions with its annual Silver Quill Award. While the company’s thought leaders present technical content at industry events throughout the year, Silver Quill provides special recognition to the most innovative and cutting-edge papers.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 3

08/07/2024 | I-Connect007 Editorial Team
In this chapter, readers learn about the use of HRL3 alloy in solder joints to balance strength and ductility. Test results show improved performance with HRL3 alloy compared to traditional low-temperature solders.
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