The Marketing Minute: Wired for Trust
It’s Only Common Sense: The Importance of Setting Realistic Expectations
Marcy’s Musings: The Relentless Pursuit of Perfection
Summit Interconnect Acquires Royal Circuit Solutions and Affiliates
May 4, 2022 | Summit Interconnect, Inc.Estimated reading time: 2 minutes
Summit Interconnect is pleased to announce the acquisition of Royal Circuit Solutions with California operations in Hollister and Santa Ana and affiliate Advanced Assembly located in Aurora, Colorado. The acquisition expands Summit’s PCB offering in rigid, flex, rigid-flex and ATE PCBs, significantly strengthens engineering and service resources providing CAM, DFM/A, PCB design/layout, and also adds quick-turn, prototype SMT assembly services.
The combined company will provide best-in-industry use of software applications that integrate and automate engineering, stack ups, quoting, production management and customer interface. This highly developed platform will significantly improve speed and service to our valued customers.
Shane Whiteside, President and CEO of Summit Interconnect, Inc. stated, “This combination aligns the Royal and Advanced quick-turn, vertically integrated model with Summit’s differentiated production capabilities. Each entity brings capabilities to the Summit portfolio that will further strengthen our ability to serve our customers in both high-performance commercial and defense markets, as well as broaden our relationships into additional sectors. This is a very exciting milestone for Summit, Royal Circuits and Advanced Assembly and we welcome our new employees to the Summit team.”
Milan Shah, Owner and CEO of Royal Circuits commented, “We are very excited to align ourselves with the tremendous team at Summit and bring our automated software-powered approach to the Summit organization. Together, we will continue to build and scale a world-class company delivering technology solutions to solve the most complex printed circuit board challenges across all end markets.”
About Summit Interconnect: Summit Interconnect is a leading provider of complex printed circuit boards focused on fast growing defense and high-performance commercial sectors in the North American market. Summit offers solutions ranging from advanced cutting-edge prototyping to complex high mix, low-to-mid volume production. Summit’s facilities are located across California, Illinois, Colorado and Toronto, Canada. For more information, please visit: summit-pcb.com
About Royal Circuit Solutions: Established in 1998 and headquartered in Hollister, CA, Royal is one of North America’s leading providers of quick-turn, advanced technology prototype printed circuit boards. Royal provides customers across the industrial, medical, automotive, consumer, semiconductor, datacom and space markets with technology driven printed circuits in hours, not days. For more information, please visit: royalcircuits.com
About Advanced Assembly: For nearly twenty years, Advanced has helped engineers assemble PCBs in three days or less. Offering a full-range of manufacturing services for prototypes and low volume quantities. Advanced Assembly delivers at the speed of imagination. For more information, please visit: aapcb.com
Share on:
Suggested Items
Incap Helps Develop Future Talent in Robotics and Engineering in Finland
05/21/2025 | IncapIncap Corporation continues to invest in the next generation of technology professionals in Finland through its involvement in two national initiatives focused on technical and vocational education.
Jabil, AVL Collaborate on Design and Manufacturing Solutions for Automotive and Transportation Customers
05/21/2025 | BUSINESS WIREJabil Inc., a global manufacturing solutions provider to market-leading automakers, announced it has signed a memorandum of understanding (MOU) with AVL Software and Functions GmbH, the e-drive and software center of AVL List GmbH.
Altus, Danutek Expand Partnership with LPKF to Offer Laser Plastic Welding Solutions
05/21/2025 | Altus GroupAltus Group, a leading supplier of capital equipment and service support for the electronics manufacturing sector in the UK and Ireland, and its sister company Danutek, which serves Central and Eastern Europe, are expanding their technology offering through an enhanced partnership with LPKF, a specialist in laser-based manufacturing solutions.
Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America
05/20/2025 | Deca TechnologiesDeca Technologies announced the signing of an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s advanced packaging facility in Bromont, Quebec.
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
05/20/2025 | Jerome Larez -- Column: Global PCB ConnectionsIn the past decade, flex and rigid-flex PCB technology has become the fastest-growing market segment. As an increasing number of PCB companies develop the capabilities to fabricate this technology, PCB designers are becoming comfortable incorporating these designs into their products.