NovaCentrix Debuts Gold Inks for Biomedical, Electronics, High-Corrosion Environments
May 11, 2022 | PRNewswireEstimated reading time: Less than a minute
NovaCentrix is pleased to announce the release of its newest product: jettable gold ink. The Metalon JG.line of jettable gold inks are ideal for applications like biomedical and electronics. Early customers include advanced R&D groups as well as universities and institutes.
Featuring excellent electrical and physical performance properties, the company's Metalon gold inks are the perfect solution for applications requiring bio-compatibility or high levels of corrosion resistance.
NovaCentrix gold inks can be cured with traditional thermal processes, or with PulseForge tools featuring the revolutionary Digital Thermal Processing – the only solution that can dry, sinter, and solder at an industrial scale on low-temp heat-sensitive substrates without damage.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.

 
                         
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
                                         Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
                                         Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
                                         Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4





 
                     
                 
                    