Flexible Thinking: Unlocking the Key to Rigid-flex Design Success
Happy’s Tech Talk #15: Printed Electronics Using FlexPCB Technologies' Subsidiary iNPACK to Exhibit at IMS Show
June 14, 2022 | Andy Shaughnessy, I-Connect007Estimated reading time: Less than a minute
Jeff De Serrano, president of PCB Technologies USA, discusses the launch of their new company, iNPACK, which focuses on high-tech substrate technologies, microelectronics assembly, and electronics packaging. He details his plans to continue expanding iNPACK over the next year and to meet with customers and exhibit at the International Microwave Symposium Show in Denver June 19-24.
To download the audio (mp3) file. click here.
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