I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 9, 2022 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes

It feels like the first day of school. It’s September, and we’re all officially back at our desks, workstations, or kitchen tables. Even Les Vacances is over. Oui, c’est vrai!
But instead of facing new teachers, we have to deal with diverse market forces, supply chain issues, and technology that never seems to stop evolving. Of course, that’s what makes this industry so interesting, isn’t it?
This week we highlight some news from industry organizations, an update on the CHIPS Act, and a few columns that focus on failures and what we can learn from them. As Dan Beaulieu points out, failure is an important part of succeeding in the long run, and our industry needs to stop being so “failure-phobic.”
Hold on to your hats, folks. It’s going to be a busy fall! See you in a few weeks.
IPC APEX EXPO 2023 Offers New Courses, New Instructors, and IPC E-Textiles
Published September 9
Today, registration opened for IPC APEX EXPO 2023 in San Diego, slated for Jan. 21–26, 2023. Co-located with the IPC E-Textiles conference on Jan. 23, 2023, the theme for the show is “Advances in a New Era.” The event will feature conference tracks for PCB design, fabrication, and assembly, and we’ll see the return of the PCB design competition as well.
This marks the last IPC APEX EXPO in San Diego for a few years; the show will be held at the Anaheim Convention Center from 2024 through 2026.
Will Marsh: CHIPS Act Update
Published September 6
In one of the few bipartisan efforts to take place in Washington lately, the CHIPS Act was voted through Congress and signed into law by the president. Color me skeptical, but what happens after this whole Kumbaya vibe has faded and it’s time to get to work? Editor Nolan Johnson asks PCBAA President Will Marsh to explain what’s next for this endeavor, and Will fills us in on details of the Supporting American Printed Circuit Boards Act of 2022 as well.
It’s Only Common Sense: It’s Time to Fail
Published September 5
Columnist Dan Beaulieu had a great piece this week on the importance of failing, and being able to learn from our failures. Too often, this industry places a premium on succeeding right now, on the first attempt, and woe to those who suffer a snafu or two along the way. Dan takes a look at some of the failures suffered by people who are now household names, including Henry Ford, Jerry Seinfeld, and Michael Jordan. My favorite MJ story: He missed 9,000 shots in his career.
EIPC Technical Snapshot Webinar
Published September 7
In keeping with the back-to-school theme, EIPC is offering a Technical Snapshot Webinar on Sept. 14 at 15:00 CET. Moderated by EIPC President Alun Morgan, the webinar features four 15-minute presentations, followed by a Q&A session. It’s free to EIPC members and only 50 euros for non-members. Don’t be tardy.
X-Rayted Files: My Favorite BGA Assembly Ever, Part 3
Published September 7
In his latest column, Bill Cardoso discusses his “favorite BGA assembly ever.” As he points out, it’s not his fave because it worked wonderfully; on the contrary, it has so many defects that it’s a perfect illustration of the problems he encounters in BGA assembly every day. Do you have a similar “favorite” PCB project that failed so badly that it’s a textbook example of what not to do?
Suggested Items
Innovative Technology Advancements in Test: HATS² Technology and Its Impact on Reliability Testing
05/13/2025 | Barry Matties, I-Connect007Ensuring the reliability of printed circuit boards (PCBs) has become increasingly difficult and critical, yet the development of advanced testing methodologies is essential to meeting industry demands and addressing persistent challenges. One significant innovation is the High Acceleration Thermal Shock (HATS²) test system, which transforms how reliability testing is conducted. After 40 years in the testing business at Microtek, Bob Neves is beginning a new journey with his company, Reliability Assessment Solutions Inc. (RAS).
EWPTE 2025: Wire Processing Innovation Driving Technical Dialogue
05/13/2025 | Brittany Martin, I-Connect007From cutting-edge automation to advanced testing and harness assembly solutions, the 2025 Electrical Wire Processing Technology Expo (EWPTE) delivered a packed exhibit floor, robust technical programming, and valuable peer-to-peer connections.
Beyond the Board: Empowering the Next Generation of Tech Innovators in Electronics
05/13/2025 | Jesse Vaughan -- Column: Beyond the BoardThe electronics industry is at the heart of technological progress, driving innovative advancements that shape our world. Yet, despite the sector's rapid evolution, it faces a looming challenge: attracting and retaining young talent. With an aging workforce and an increasing demand for skilled professionals, the industry must find ways to inspire the next generation of innovators.
Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand
05/13/2025 | Prashant Patel -- Column: Facing the FutureInnovations that push the boundaries of connectivity shape the future of technology, processing power, and miniaturization. 5G and emerging 6G technologies are critical in transforming industries from telecommunications and healthcare to autonomous systems. This affects the printed circuit board (PCB) industry, where demand for high-performance, miniaturized, and advanced PCBs is surging. This column explores the key applications of 5G and beyond, the challenges in designing high-frequency PCBs, the effects of miniaturization, industry collaborations, and opportunities for North American companies in this space.
Barnes Aerospace Appoints George Whittier as CEO
05/12/2025 | BUSINESS WIREBarnes Aerospace, a global provider of component repair services and manufacturer of highly-engineered parts primarily for aeroengines and an operating division of Barnes Group Inc., announced the appointment of George Whittier to the newly created role of CEO, effective May 12, 2025.